Liquid Processing Method for Substrate Drying
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Solution Overview
Problem
In high integration or high aspect ratio semiconductor devices, the process of removing rinsing liquid from a substrate in a spin cleaning device often results in pattern collapse due to uneven drying, and existing methods of hydrophobizing using hydrophobic gases can lead to substrate contamination with particles.
Innovation Solution
A liquid processing method and device that alternately supplies a hydrophobic gas and rinsing liquid to the substrate while rotating, gradually widening the hydrophobized region and reducing the rotation speed during drying to prevent pattern collapse and contamination, using a solvent to remove reaction byproducts between hydrophobizing and drying.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a rinsing liquid is shaken off from the substrate surface, then the substrate is dried, but pattern collapse occurs due to uneven drying and surface tension imbalance
Solution Approach 1:
The substrate surface is hydrophobized before the rinsing liquid removal step. By applying a hydrophobic agent in advance, the surface tension of the rinsing liquid is reduced, preventing pattern collapse during the subsequent drying phase when the rinsing liquid is shaken off.
Solution Approach 2:
The contact angle between the substrate and rinsing liquid is modified by hydrophobization treatment. This changes the surface energy parameters, reducing surface tension forces that cause pattern collapse, while maintaining the drying function.
2Manufacturing precision
If a liquid hydrophobic agent is supplied to the substrate surface, then hydrophobization is achieved, but particle contamination occurs on the substrate
Solution Approach 1:
The liquid hydrophobic agent is vaporized and supplied as a gas phase substance to the substrate surface. This pneumatic delivery method eliminates particle contamination associated with liquid application, while still achieving effective hydrophobization through vapor-phase deposition.
Solution Approach 2:
The hydrophobic agent transitions from liquid phase to gas phase through vaporization before contacting the substrate. This phase change enables contamination-free application, as the gas phase avoids introducing liquid-borne particles onto the substrate surface.
3Loss of substance
If a hydrophobic gas is supplied to the substrate surface, then the amount of hydrophobic agent is reduced, but substrate contamination with multiple particles occurs
Solution Approach 1:
The system uses a liquid hydrophobic agent vaporization mechanism where the liquid is converted to gas phase for substrate treatment. This maintains low agent consumption benefits while eliminating the particle contamination problem associated with direct gas-phase hydrophobic agents.
Solution Approach 2:
The liquid hydrophobic agent serves as an intermediary substance that is vaporized to create a clean gas phase treatment environment. The liquid phase reservoir allows for controlled vaporization without directly contacting the substrate, thus avoiding particle contamination while maintaining efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses watermark formation and particle contamination by gradually widening the hydrophobized region and using a solvent to remove reaction byproducts, ensuring efficient drying without pattern collapse.
Implementation Method 1
hydrophobizing the substrate by alternately repeating supply of the hydrophobic gas for hydrophobizing the surface of the substrate to the surface of the substrate from the hydrophobic gas nozzle while rotating the substrate
Implementation Method 2
supplying the rinsing liquid from the rinsing liquid nozzle to the surface of the substrate while rotating the substrate to replace the chemical liquid by the rinsing liquid
Implementation Method 3
drying the substrate by removing the rinsing liquid through rotation of the substrate
Data Source
AI summary
[Problem] To provide a liquid processing method with which, while alleviating a watermark occurring in the surface of a substrate, it is possible to hydrophobize the surface using a hydrophobing gas. [Solution] A substrate (W), retained in substrate retaining parts (21, 22, 23), is rotated and has a liquid compound supplied to the surface thereof, whereby a liquid process is carried out. Next, a rinse liquid is supplied to the surface of the substrate (W) while the substrate (W) is rotated, and the liquid compound is replaced with the rinse liquid. Next, supplying a hydrophobing gas for hydrophobizing the surface of the substrate (W) and supplying the rinse liquid to the surface of the substrate (W) after supplying the hydrophobing gas are repeated alternately, thus hydrophobizing the substrate (W). Next, the rinse liquid is removed by rotating the substrate (W), drying the substrate (W).