Liquid-Cooled Server Layout for PCIe GPU Cooling Simplification

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Solution Overview

Problem

The complexity of applying liquid cooling technology to PCIe version GPUs in servers due to their independent structure and variable mounting positions, which requires separate cooling plates and connectors, complicates maintenance and increases power consumption.

Innovation Solution

A liquid-cooled server design with a chassis and a liquid-cooling heat dissipation system that includes a liquid cooling loop, conversion device, and leakage detection system, allowing for flexible configuration and efficient heat removal from central processing units, memory banks, and graphics processing units using a unified cooling liquid supply and return system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If air cooling with high-speed fans is used for PCIe version GPUs, then cooling effect is achieved, but noise increases and power consumption increases

Engineering Contradiction:

ImproveGPU temperatureVSAvoidnoise

Core Design Contradiction:

TemperatureVSObject-generated harmful factors

Solution Approach 1:

The patent replaces the mechanical air cooling system (high-speed fans) with a liquid cooling system that uses coolant circulation through cooling plates. This substitution eliminates the need for high-speed rotating fans, thereby reducing noise while maintaining effective heat dissipation from GPU components.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent implements a liquid cooling system that circulates coolant through cooling plates in contact with heating components. This hydraulic approach uses fluid flow to transfer heat away from GPUs and other components, providing silent operation compared to mechanical fan-based air cooling.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Temperature

If liquid cooling technology is applied to PCIe version GPUs with independent structures, then cooling effectiveness is improved, but system complexity increases due to separate cooling plates and connectors for each GPU card

Engineering Contradiction:

ImproveGPU temperatureVSAvoidcooling system structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent divides the cooling system into modular cooling plates that can be independently installed on each PCIe GPU card. Each cooling plate is a separate component that interfaces with its corresponding GPU, allowing for flexible configuration and independent maintenance while maintaining overall system cooling effectiveness.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent designs cooling plates with standardized interfaces and mounting mechanisms that can be universally applied to different PCIe GPU cards. This universal design approach reduces system complexity by using common cooling plate configurations across multiple GPUs rather than requiring custom cooling solutions for each card.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures reliable operation of CPU, memory, and GPU components within normal temperature ranges, significantly increasing the proportion of liquid cooling in server power consumption to 90% or above, reducing data center PUE, and enhancing maintenance safety through integrated leakage detection.

Implementation Method 1

cooling liquid in the liquid cooling loop flows through a liquid cooling plate at the central processing unit, a liquid cooling assembly at the memory bank, and the graphics processing unit, and removes heat generated by the central processing unit through the liquid cooling plate

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentEP4671920A1Liquid-cooled server

Publication Date: 2025.12.31 INSPUR SUZHOU INTELLIGENT TECH CO LTD

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AI summary

Disclosed is a liquid-cooled server, including a chassis and a liquid-cooling heat dissipation system. The chassis has an accommodating cavity, a main control panel, a central processing unit, a memory bank, and a graphics processing unit are arranged inside the accommodating cavity, the central processing unit, the memory bank, and the graphics processing unit are electrically connected to the main control panel; the liquid-cooling heat dissipation system is at least partially located inside the accommodating cavity, the liquid-cooling heat dissipation system includes a liquid cooling loop, a cooling liquid in the liquid cooling loop flows through a liquid cooling plate at the central processing unit, a liquid cooling assembly at the memory bank, and the graphics processing unit, and removes heat generated by the central processing unit through the liquid cooling plate and heat generated by the memory bank through the liquid cooling assembly, and removes heat generated by the graphics processing unit by flowing through the graphics processing unit. The present invention solves a problem that a liquid cooling manner for the liquid-cooled server in the related art is complex.