Liquid Solvent Abutment Unit for Wafer Detachment
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Solution Overview
Problem
Conventional methods for detaching a support plate from a wafer using a liquid solvent are inefficient due to solvent retention in through holes, leading to prolonged reaction times and reduced production efficiency.
Innovation Solution
A liquid solvent abutment unit comprising a supply part, retention part, recovery part, and vibration unit that enhances solvent circulation and reaction with the adhesive member by vibrating the solvent within the through holes, along with a detection unit for optimal operation and temperature adjustment to control the vibration and solvent temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a support plate with through holes is used to supply liquid solvent to the adhesive member, then the solvent can reach the adhesive member through the through holes, but the liquid solvent remains accumulated in the through holes hampering smooth circulation and requiring substantial time for complete reaction
Solution Approach 1:
The invention introduces a vibration unit that applies mechanical vibration to the liquid solvent in the through holes. This vibration disrupts the accumulated solvent, enhances its circulation and contact with the adhesive member, and accelerates the dissolution reaction without requiring extended time. The vibration energy promotes faster solvent movement and reaction kinetics.
2Ease of operation
If the liquid solvent is supplied through the through holes to dissolve the adhesive member, then the support plate can be detached from the wafer, but the accumulated solvent in the through holes hampers smooth circulation requiring substantial length of time
Solution Approach 1:
The vibration unit applies mechanical oscillation to the liquid solvent, creating vigorous circulation patterns that rapidly mix the solvent with the adhesive member. This dramatically reduces the time required for complete dissolution and detachment, thereby improving production efficiency and throughput.
Solution Approach 2:
The system employs periodic vibration cycles to agitate the solvent in the through holes. This periodic action creates repeated cycles of solvent movement, contact, and refreshment, ensuring continuous and efficient dissolution of the adhesive member while maintaining high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly shortens the time required to detach the support plate from the wafer by improving solvent circulation and reaction efficiency, thereby enhancing production efficiency.
Implementation Method 1
a vibration unit for vibrating the liquid solvent
Implementation Method 2
a liquid solvent supplied to a hole-formed region made of a support plate... dissolving it
Data Source
AI summary
In order to provide a liquid solvent abutment unit for accelerating the reaction of a liquid solvent against an adhesive member existing between a perforated support plate and a wafer, a liquid solvent abutment unit includes a supply part for supplying a support plate surface with a liquid solvent, a retention part for retaining the supplied liquid solvent in the hole-formed region on the support plate surface; a recovery part for recovering the liquid solvent retained in the hole-formed region, and a vibration unit for vibrating the liquid solvent.