Liquid Submersion Cooling With Gravity Return Manifolds
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing liquid submersion cooling systems for electronic devices rely heavily on pump pressure for both liquid delivery and return, which can be costly and complex, and do not efficiently manage cooling liquid levels and flow rates.
Innovation Solution
A system utilizing gravity return manifolds and dielectric cooling liquids, where cooling liquid is returned to a reservoir via gravity, with pump pressure only used for delivery, and controlled by weirs to maintain optimal liquid levels and flow rates for efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pump pressure is used for both liquid delivery and return in existing liquid submersion cooling systems, then the cooling liquid can be circulated through electronic devices, but the system complexity and cost increase
Solution Approach 1:
The patent divides the cooling liquid circulation system into two separate functional segments: a delivery system using pump pressure to supply cooling liquid to electronic devices, and a return system using gravity and weir structures to return cooling liquid to the reservoir. This segmentation eliminates the need for return pumps, reducing system complexity while maintaining reliable circulation
Solution Approach 2:
The patent replaces the mechanical pump-based return system with a gravity-based passive return system. By substituting the mechanical pumping mechanism with gravitational force and hydraulic structures (weirs), the system reduces mechanical complexity and moving parts while maintaining effective cooling liquid circulation
2Reliability
If pump pressure is used for both liquid delivery and return, then cooling liquid can be circulated, but the system cost increases
Solution Approach 1:
The patent extracts the return pump component from the cooling liquid circulation system, eliminating the need for expensive pumping equipment on the return side. By taking out this mechanical component and replacing it with passive gravity-based structures, the system cost is reduced while maintaining reliable circulation through the electronic devices
3Temperature
If conventional cooling systems are used, then electronic devices can be cooled, but liquid level and flow rate management is inefficient
Solution Approach 1:
The patent implements self-regulating weir structures that automatically maintain optimal liquid levels and control flow rates through passive hydraulic principles. The weirs self-adjust the cooling liquid flow based on液位 height without requiring external control systems, making the system easier to operate while maintaining effective cooling of electronic devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces system complexity and cost while enhancing cooling efficiency by minimizing the need for pumps on the return side and optimizing liquid flow, maintaining superior cooling performance compared to air cooling.
Implementation Method 1
a returning supply flow of the cooling liquid may also be directed onto one or more of the heat generating electronic components
Implementation Method 2
dielectric cooling liquid is in the interior space with the dielectric cooling liquid submerging and in direct contact with the heat generating electronic components
Implementation Method 3
gravity can be used to return the cooling liquid to a reservoir via a cooling liquid gravity return manifold
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Liquid submersion cooling systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool an array of electronic devices. In some embodiments described herein, rather than using pump pressure to return the cooling liquid back to a cooling liquid reservoir, gravity can be used to return the cooling liquid to a reservoir via a cooling liquid gravity return manifold, and a pump can only be used on the liquid supply side to deliver the cooling liquid to each electronic device.