Process Liquid Supply Device Temperature Stabilization
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Solution Overview
Problem
In single-wafer-type substrate processing devices, maintaining the temperature of the process liquid within a narrow range is crucial for uniform etching. However, the existing systems face challenges in stabilizing the liquid temperature due to irregular and variable collection of process liquid, leading to non-uniformity in etching depth.
Innovation Solution
A supply device comprising a collect tank and a supply tank, where the collect tank collects and heats the process liquid, and the supply tank further heats and supplies the liquid to the substrate processing device. The tanks are divided into regions to stabilize the liquid temperature, with heaters and piping systems ensuring efficient temperature control and flow management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the process liquid is collected in a single tank from multiple substrate processing devices, then the efficiency of liquid collection is improved, but the temperature control becomes difficult due to variable collection timing and amount
Solution Approach 1:
The single collection tank is divided into multiple separate tanks, each collecting process liquid from a specific substrate processing device. This segmentation isolates the variable collection timing and amount from each device, preventing temperature fluctuations in one tank from affecting others, thereby maintaining temperature control precision while preserving collection efficiency.
Solution Approach 2:
A temperature control device is introduced as an intermediary between the collection tank and the substrate processing device. This intermediary actively adjusts and stabilizes the liquid temperature, compensating for temperature variations caused by irregular collection patterns, thus resolving the contradiction between efficient collection and precise temperature control.
2Manufacturing precision
If the heater output is increased to compensate for temperature decrease, then the temperature control is improved, but the heating time is extended due to the time required to decrease the heater output
Solution Approach 1:
The system performs preliminary heating of the process liquid in the collection tank before it is supplied to the substrate processing device. By pre-heating the liquid in advance, the system ensures that the liquid reaches the required temperature without needing to rapidly adjust heater output, thereby reducing the time lost during heating and temperature adjustments.
Solution Approach 2:
A temperature sensor detects the actual temperature of the process liquid and provides feedback to the temperature control device. This feedback mechanism enables real-time adjustment of the heater output, allowing the system to maintain optimal heating performance while minimizing the time required to adjust heater output, thus resolving the contradiction between temperature control precision and heating time.
3Productivity
If multiple substrate processing devices are connected to a single tank, then the system efficiency is improved, but the temperature stability deteriorates due to overlapping processing timings
Solution Approach 1:
The system segments the single common tank into multiple separate tanks, with each tank dedicated to collecting process liquid from a specific substrate processing device. This segmentation eliminates the temperature instability caused by overlapping processing timings across multiple devices, as each tank independently collects and maintains stable temperature for its associated device, while still achieving high system efficiency through parallel operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The supply device effectively stabilizes the liquid temperature of the process liquid, reducing the risk of non-uniform etching and facilitating precise temperature control, thereby enhancing the productivity and quality of substrate processing.
Implementation Method 1
a first heater which is provided on a path through the piping and which heats the process liquid
Implementation Method 2
a second heater which is provided on a path through the supply piping and which heats the process liquid
Data Source
AI summary
A supply device includes a collect tank which collects a process liquid from a substrate processing device and heats the collected liquid, and a supply tank connected to the collect tank and which supplies, to the substrate processing device, the process liquid heated in the collect tank. The collect tank includes a collect container that stores the process liquid, a first dividing plate that divides the collect container into a first region where the process liquid is introduced from the substrate processing device, and a second region that introduces the process liquid to the supply tank, piping that feeds, to the second region, the process liquid introduced in the first region, a first heater provided on a path through the piping and which heats the process liquid, and feed piping that feeds, to the supply tank, the process liquid in the second region and heated by the first heater.