Liquid-Tension Frame Transfer Pad Without Grooves or Suction
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Solution Overview
Problem
Existing transfer methods for frame units and chip manufacturing require costly pads with specialized grooves and suction mechanisms, leading to high manufacturing and operating costs, and are prone to contamination due to drying and separate transfer of components.
Innovation Solution
A transfer apparatus and method using a pad with specific surface areas and interfacial tension to hold and move frame units without grooves or suction, reducing costs and preventing contamination by using liquid interfacial tension to secure and transfer frame units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If grooves are formed in the holding surface of the pad to generate negative pressure according to Bernoulli's theorem, then the wafer can be held during transfer, but the manufacturing cost of the pad increases
Solution Approach 1:
The invention extracts the groove structure from the pad design and replaces it with a simplified flat holding surface. The liquid supply unit directly provides liquid to the holding surface, eliminating the need for complex groove formations while maintaining the negative pressure effect through the liquid supply mechanism itself.
Solution Approach 2:
Instead of forming actual grooves in the pad, the invention uses a liquid film to create a virtual groove effect. The liquid supplied to the holding surface forms a thin film that replicates the flow path function of physical grooves, achieving the same negative pressure generation without the manufacturing complexity.
2Reliability
If a suction mechanism (ejector or vacuum pump) is used to generate suction force from the pad to the frame, then the frame unit can be held on the holding surface, but compressed air or electric power must be supplied constantly, increasing operating cost
Solution Approach 1:
The liquid supply unit serves dual purposes: it supplies liquid to prevent drying and contamination, and simultaneously generates the negative pressure required for holding the frame unit. This self-service mechanism eliminates the need for separate suction mechanisms that require continuous energy input.
Solution Approach 2:
The invention replaces the mechanical suction mechanism (ejector or vacuum pump) with a fluid-based system. By controlling the liquid supply rate and pressure, the system generates the necessary holding force without requiring compressed air or electric power for continuous operation.
3Object-affected harmful factors
If liquid is supplied to the plate-shaped object and suction force is caused to act from the pad to the frame, then contamination can be prevented from adhering to the plate-shaped object, but the complexity of the transfer system increases
Solution Approach 1:
The invention merges the contamination prevention function and the holding function into a single integrated system. The liquid supply unit that prevents drying and contamination also generates the negative pressure for holding, eliminating the need for separate systems and reducing overall complexity.
Solution Approach 2:
The liquid supplied to the system performs multiple functions simultaneously: it prevents drying of the plate-shaped object, prevents contamination adhesion, and generates negative pressure for holding the frame unit. This multi-functionality reduces the number of separate components needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method reduces manufacturing costs by eliminating the need for grooved pads and suction mechanisms, while preventing contamination and ensuring efficient transfer of frame units and chips by utilizing interfacial tension of liquid.
Implementation Method 1
the frame unit is held on the holding surface side by use of interfacial tension of the liquid in a still state
Implementation Method 2
the liquid being supplied from the liquid supply unit and filling gaps between the first area and the plate-shaped object, and between the second area and the plate-shaped object
Data Source
AI summary
A transfer apparatus includes a pad for holding a frame unit on a holding surface side thereof, a liquid supply unit configured to supply liquid to the holding surface side of the pad, and a moving mechanism configured to move the pad. The holding surface has a first area and a second area surrounding the first area and protruding with respect to the first area. In a state in which the first area faces a plate-shaped object and the second area surrounds the plate-shaped object, the frame unit is held on the holding surface side by use of interfacial tension of liquid in a still state, the liquid being supplied from the liquid supply unit and filling gaps between the first area and the plate-shaped object, and between the second area and the plate-shaped object, and then the moving mechanism moves the pad to transfer the frame unit.