Liquid TIM Lid Structure for IC Heat Dissipation Without Leakage
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Solution Overview
Problem
Existing thermal interface materials (TIMs) in Flip Chip packages fail to dissipate heat efficiently and are costly, while liquid metal TIMs pose challenges due to low viscosity and melting point below room temperature, leading to leakage and reduced heat dissipation.
Innovation Solution
The electronic device incorporates a lid with openings for fluid transfer, filled with a liquid thermal interface material (TIM) that conducts heat from the IC die to the lid, and a stopper structure to contain the liquid TIM, preventing leakage and ensuring effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid metal TIM is used to improve heat dissipation, then thermal performance is improved, but leakage occurs due to low viscosity and melting point below room temperature
Solution Approach 1:
The stopper structure is formed on the lid surface before injecting the liquid metal TIM. This preliminary action creates a containment barrier that prevents leakage of the low-viscosity liquid metal while allowing it to be injected through the opening and fill the gap between the IC die and lid for effective heat dissipation.
Solution Approach 2:
The stopper structure acts as an intermediary element between the liquid metal TIM and the external environment. It contains the liquid metal within the desired gap region, preventing it from leaking out while still allowing the liquid metal to perform its heat conduction function between the IC die and lid.
2Quantity of substance
If liquid metal TIM is used to reduce cost, then cost is reduced, but bubble formation occurs reducing heat dissipation
Solution Approach 1:
The stopper structure is formed before liquid metal TIM injection to define the filling region. This preliminary containment structure guides the liquid metal flow and prevents bubble entrapment during the injection process, ensuring complete gap filling without voids that would impede heat dissipation.
3Reliability
If traditional TIM materials are used to prevent leakage, then reliability is improved, but thermal performance is insufficient
Solution Approach 1:
The solution segments the containment function from the heat transfer function. The stopper structure handles the containment/reliability function, while the liquid metal TIM handles the heat transfer function. This segmentation allows each component to be optimized for its specific function without compromise.
Solution Approach 2:
The stopper structure serves as an intermediary that enables the use of high-performance liquid metal TIM by providing the necessary containment. It mediates between the conflicting requirements of using low-viscosity liquid metal for heat transfer while preventing its leakage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation by utilizing a high-conductivity liquid metal TIM, contained by a stopper structure, which effectively addresses the inefficiencies and cost issues of traditional TIMs while preventing leakage and bubble formation.
Implementation Method 1
a liquid thermal interface material (TIM) filling the space and being formulated to conduct heat from the IC die to the lid
Data Source
AI summary
An electronic device includes (i) an integrated circuit (IC) die mounted on a substrate, (ii) a lid having first and second surfaces facing one another, and one or more openings formed through the lid between the first and second surfaces, the lid being disposed over at least the IC die to form a space between the IC die and the first surface of the lid, the one or more openings are configured to enable transference of fluids through the lid, (iii) a liquid thermal interface material (TIM) filling the space and being formulated to conduct heat from the IC die to the lid, and (iv) a stopper structure extended from the first surface of the lid, the stopper structure includes one or more sidewalls configured to contain the liquid TIM at least in the space between the IC die and the first surface of the lid.