Liquid-Vapor Separation Plate for Heat Pipe Vapor Chamber
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Solution Overview
Problem
Conventional heat conductive structures combining heat pipes and vapor chambers face inefficiencies due to increased vapor flow speed interfering with liquid flow back, leading to reduced heat dissipation and potential vapor chamber heating without liquid presence, and discontinuous liquid flow.
Innovation Solution
A liquid-vapor separating type heat conductive structure is introduced, featuring a separation plate that separates vapor and liquid passages, allowing the liquid-phase working fluid to flow back without interference from vapor phase, enhancing flow speed and continuity through capillary structures within the vapor and heat pipes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the heat pipe is connected to the vapor chamber to form a heat conductive structure, then heat transfer capability is improved, but the liquid-phase working fluid flow back is interfered by increased vapor flow speed, causing discontinuous flow and reduced heat dissipation efficiency
Solution Approach 1:
The patent divides the internal passage into separate vapor passage and liquid passage using a separation plate. This segmentation allows vapor and liquid phases to flow independently without interference, resolving the contradiction between improved heat transfer capability and maintained liquid flow continuity.
Solution Approach 2:
The separation plate acts as an intermediary structure that physically separates the vapor and liquid flow paths. This mediator prevents the increased vapor flow speed from interfering with liquid flow back, ensuring continuous liquid circulation while maintaining effective heat transfer.
2Speed
If the cross-sectional area of the heat pipe is reduced to increase flow speed, then vapor flow speed is boosted, but liquid flow back is interfered and heat dissipation efficiency is reduced
Solution Approach 1:
By segmenting the flow paths into separate vapor and liquid passages, the patent enables independent optimization of each phase flow. The vapor can maintain high flow speed through the heat pipe while the liquid flow back remains uninterrupted, preserving heat dissipation efficiency.
Solution Approach 2:
The separation plate serves as an intermediary that allows high vapor flow speed without compromising liquid flow. It mediates between the two phases, enabling the vapor to move rapidly through the heat pipe while the liquid continues to flow back continuously through its dedicated passage.
3Device complexity
If no separation structure is used, then device complexity is reduced, but vapor and liquid phases interfere with each other, causing liquid to flow back discontinuously
Solution Approach 1:
The separation plate provides a simple yet effective segmentation of flow paths. This relatively simple structural addition resolves the interference between vapor and liquid phases, ensuring continuous liquid flow back without requiring complex control mechanisms.
Solution Approach 2:
The separation plate acts as a simple intermediary structure that prevents phase interference. It is a straightforward component that divides the internal passage into separate vapor and liquid channels, maintaining liquid flow continuity without adding significant structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure boosts the flow speed of liquid-phase working fluid, ensuring continuous heat dissipation and preventing vapor chamber heating without liquid, thereby improving heat transfer efficiency.
Implementation Method 1
a first capillary structure is disposed on an inner surface of the bottom plate, and a second capillary structure is disposed inside the pipe body
Implementation Method 2
the working fluid is filled inside the cavity
Implementation Method 3
a working fluid in vapor phase inside the heat pipe
Implementation Method 4
heat pipe and vapor chamber are connected together to form a heat conductive structure
Data Source
AI summary
A liquid-vapor separating type heat conductive structure includes a vapor chamber, a heat pipe, a separation plate, and a working fluid. The vapor chamber includes a housing and a cavity. The housing includes a bottom plate and an upright plate. A first capillary structure is disposed on an inner surface of the bottom plate, and a through hole is formed on the upright plate. The heat pipe includes a pipe body and a second capillary structure. The pipe body includes an open end, the open end of the pipe body is inserted and sealingly connected to the through hole. The separation plate is disposed at the open end and covers the first capillary structure and the second capillary structure, so as to form a vapor passage and a liquid passage at two sides of the separation plate respectively. The working fluid is filled inside the cavity.