Evaporation Apparatus for Lithium Deposition via Gas Pressure Control
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Solution Overview
Problem
Current thin film lithium battery deposition systems face challenges in managing the high reactivity of alkali and alkaline earth metals, particularly lithium, which limits high volume and low-cost manufacturing due to issues like oxidation, valve blockage, and low melting point constraints on deposition rates.
Innovation Solution
A depositing arrangement and apparatus that liquefies alkali or alkaline earth metals in a gas-inlet chamber, using a line with defined flow resistance and controlled gas pressure to regulate the flow rate, eliminating the need for mechanically working valves and allowing for uniform vapor deposition on substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional evaporation systems use mechanically working valves to control liquid lithium flow, then flow control is achieved, but valve blockage occurs due to slug/particle formation and high reactivity
Solution Approach 1:
The patent removes the mechanically working valve from the system entirely. Instead of controlling liquid lithium flow through a valve, the system uses a capillary tube with defined flow resistance that passively regulates flow based on pressure differential, eliminating the source of blockage and mechanical failure.
Solution Approach 2:
The patent introduces a capillary tube as an intermediary flow resistance element between the liquid lithium source and evaporation zone. This capillary tube acts as a flow regulator that converts pressure control into flow control without requiring mechanical valves to contact the reactive lithium.
2Productivity
If sputtering methods are used for lithium deposition, then deposition is achieved, but manufacturing cost and complexity increase due to target reactivity and handling requirements
Solution Approach 1:
The patent replaces the mechanical sputtering process with a thermal evaporation process. Instead of using a sputtering target and ion bombardment, the system heats liquid lithium in a crucible to produce vapor for deposition, simplifying target handling and eliminating sputtering-specific complexity.
Solution Approach 2:
The patent changes the deposition mechanism from momentum transfer (sputtering) to thermal vaporization. By controlling temperature parameters of the liquid lithium and using gas pressure to regulate flow, the system achieves deposition without the mechanical complexity of sputtering targets and power supplies.
3Productivity
If high power density sputtering regime is applied, then deposition rate increases, but lithium melting point limitation prevents achieving high deposition rates
Solution Approach 1:
The patent utilizes the phase transition of lithium from liquid to vapor directly in the evaporation zone. By maintaining lithium in liquid form in the crucible (below melting point constraints) and allowing it to vaporize in the high-temperature evaporation zone, the system achieves high deposition rates without being limited by the melting point during the deposition process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high deposition rates and uniformity while reducing manufacturing costs and handling complexities associated with reactive materials, enhancing the scalability and efficiency of lithium-based battery production.
Implementation Method 1
a valve (140) configured for controlling a flow rate of the gas in the first chamber (110) for controlling a flow rate of the liquefied material through the line (120) having said flow resistance
Implementation Method 2
an evaporation zone (114) configured for vaporizing the liquefied material
Implementation Method 3
deposition of the material on a substrate
Data Source
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Figure 5
AI summary
A depositing arrangement for evaporation of a material including an alkali metal or alkaline earth metal, and for deposition of the material on a substrate is described. The depositing arrangement includes a first chamber configured for liquefying the material, wherein the first chamber comprises a gas inlet configured for inlet of a gas in the first chamber, an evaporation zone configured for vaporizing the liquefied material, a line providing a fluid communication between the first chamber and the evaporation zone for the liquefied material, wherein the line includes a first portion defining a flow resistance of the line, a valve configured for controlling the flow rate of the gas in the first chamber for controlling a flow rate of the liquefied material through the line having said flow resistance, and one or more outlets for directing the vaporized material towards the substrate.