Lithographic Component Cooling via Gas Flow Restriction
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Solution Overview
Problem
Lithographic apparatus components face undesirable heat loads, leading to local deformation and imaging errors due to temperature variations and inefficient cooling systems that either fail to reach set point temperatures or affect adjacent components.
Innovation Solution
A local cooling system using a gas passageway with a flow restriction to direct cooled gas and apply a controlled cooling load to components, leveraging the Joule-Thomson effect for efficient temperature regulation and re-use of coolant gas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling systems are used to remove heat from components, then cooling efficiency is improved, but thermal inertia and risk of leakage increase
Solution Approach 1:
The patent replaces liquid cooling systems with a gas-based cooling system using helium or nitrogen. The gas flows through channels in the component carrier, absorbing heat from components without the leakage risks associated with liquids. The system uses pressure control and flow regulation to maintain effective cooling while eliminating contamination concerns.
2Temperature
If cooling medium temperature is lowered to reach set point temperature, then cooling effectiveness is improved, but adjacent components are adversely affected
Solution Approach 1:
The patent implements localized cooling zones with independent temperature control for different regions of the component carrier. Each cooling channel can be regulated separately, allowing precise temperature management at specific locations without over-cooling adjacent areas. This enables achieving set point temperatures for heat-generating components while maintaining appropriate temperatures for neighboring components.
3Temperature
If conventional cooling systems are used, then cooling capacity is sufficient, but system complexity and thermal inertia increase
Solution Approach 1:
The patent employs passive cooling features where the component carrier structure itself serves as the cooling pathway. Heat is conducted directly from components through the carrier material to cooling channels, eliminating the need for active pumping systems and complex thermal management infrastructure. The system uses natural convection and conduction to achieve effective cooling with minimal mechanical components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively maintains components at or near set point temperatures, reducing imaging errors and allowing for flexible cooling control without the thermal inertia of liquid-based systems, while minimizing the risk of liquid leakage and contamination.
Implementation Method 1
A local cooling system uses a gas passageway with a flow restriction to direct cooled gas and apply a controlled cooling load to components, leveraging the Joule-Thomson effect for efficient temperature regulation
Data Source
AI summary
A lithographic apparatus includes a component and a local cooler to apply a local cooling load to the component. The local cooler has a gas passageway including a flow restriction upstream of the component and configured to direct a flow of gas exiting the flow restriction to cool a surface of the component.