Lithographic Apparatus Control Using Common Merit Function
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Solution Overview
Problem
Existing process control methods in lithographic processes are limited in their ability to effectively monitor and control the application of patterns on substrates, leading to inefficiencies and potential defects in integrated circuit manufacturing.
Innovation Solution
A method for configuring a lithographic apparatus by obtaining substrate-specific data and determining a configuration for at least two different control regimes using a common merit function, allowing for optimized control of the lithographic process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If existing process control methods are used to monitor and control pattern application on substrates, then the lithographic process can be performed, but the control precision and efficiency are insufficient leading to potential defects
Solution Approach 1:
The patent implements a feedback mechanism where metrology data obtained from measuring patterned substrates is used to optimize control parameters for subsequent lithographic processes. The system continuously monitors process outcomes and adjusts control settings accordingly, creating a closed-loop control system that improves both precision and reliability over time.
Solution Approach 2:
The patent optimizes control parameters (such as focus, dose, and alignment settings) based on measured metrology data. By dynamically adjusting these parameters according to actual process outcomes, the system achieves higher pattern application accuracy and defect reduction while maintaining reliable process control.
2Manufacturing precision
If substrate-specific data is obtained and used to determine configuration for multiple control regimes, then control precision is improved, but the complexity of the control system increases
Solution Approach 1:
The patent employs a unified merit function that serves multiple control regimes simultaneously. This single optimization framework handles different control aspects (focus, dose, alignment) in a coordinated manner, achieving high control precision across all regimes without requiring separate complex control systems for each parameter.
Solution Approach 2:
The system performs preliminary optimization of control parameters using substrate-specific metrology data before actual pattern application. By pre-determining optimal configuration settings based on measured substrate characteristics, the system achieves high precision control while avoiding the need for complex real-time adjustments during the lithographic process.
Data Source
AI summary
A method for configuring an apparatus for providing structures to a layer on a substrate, the method including: obtaining first data including substrate specific data as measured and/or modeled before the providing of the structures to the layer on the substrate; and determining a configuration of the apparatus for at least two different control regimes based on the first data and the use of a common merit function including parameters associated with the at least two control regimes.