Lithography Aberration Optimization via Zernike Component Selection
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Solution Overview
Problem
Current lithography technologies face challenges in optimizing illumination modes and patterning processes due to optical aberrations, which affect the accuracy and efficiency of feature projection onto substrates, particularly at sub-wavelength scales.
Innovation Solution
A method involving the selection of significant optical aberration components in a lithography apparatus, computation of a cost function based on these components, and adjustment of the apparatus or process to minimize aberration impacts, using hardware computer systems to optimize the lithography process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If optical aberration correction is implemented in lithography apparatus, then manufacturing precision and pattern reproduction accuracy are improved, but device complexity and computational requirements increase
Solution Approach 1:
The optical aberration correction is segmented into discrete Zernike polynomial components, allowing selective correction of specific aberration types (e.g., defocus, astigmatism, coma) rather than attempting to correct all possible aberrations simultaneously. This segmentation reduces computational complexity while maintaining manufacturing precision for the most critical aberration modes.
Solution Approach 2:
The patent transforms the complex optical aberration correction problem into a parameter optimization problem by representing aberrations through Zernike polynomial coefficients. This parameterization enables efficient computational handling through cost function minimization, converting an intractable optimization problem into a manageable parameter adjustment task that improves pattern reproduction accuracy without excessive computational burden.
2Reliability
If comprehensive optical aberration correction is applied, then lithography process reliability is improved, but processing time and computational resources increase
Solution Approach 1:
The patent extracts and isolates the most significant optical aberration components using Zernike polynomial decomposition, separating the critical correction needs from less important higher-order aberrations. This extraction approach focuses computational resources on the aberration modes that most impact lithography process reliability, achieving reliable pattern transfer without the excessive computation time required for comprehensive correction of all aberration types.
Solution Approach 2:
The patent applies partial correction by focusing on the most impactful Zernike polynomial terms (lower-order aberrations) rather than attempting complete correction of all aberration modes. This partial action approach achieves sufficient process reliability for high-volume manufacturing while significantly reducing the computational time and resources that would be required for exhaustive aberration correction.
3Measurement precision
If Zernike polynomial-based aberration modeling is used, then optical aberration correction accuracy is improved, but mathematical complexity and computational overhead increase
Solution Approach 1:
The patent transforms complex optical wavefront aberrations into a standardized set of Zernike polynomial parameters, converting an complex functional description into a manageable coefficient representation. This parameter transformation enables accurate aberration measurement and correction while reducing mathematical complexity, as the Zernike basis functions provide an orthogonal decomposition that simplifies computation compared to raw wavefront data.
Solution Approach 2:
The patent creates a mathematical copy of the optical aberration field using Zernike polynomial series expansion. This polynomial copy accurately represents the complex optical aberrations in a computationally efficient form, enabling precise measurement and correction without directly manipulating the complex original wavefront data, thus reducing computational overhead while maintaining measurement precision.
Data Source
AI summary
A method including obtaining a selected component of optical aberration of or for a lithography apparatus, under a processing condition; computing an approximate of a cost function, based on the selected component; and producing an adjustment of the lithography apparatus or a patterning process that uses the lithography apparatus, based on the approximate of the cost function.


