Lithography Chuck Protruding Edge Gas Leakage

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Solution Overview

Problem

In lithography apparatuses, maintaining a constant gas concentration between the mold and substrate is challenging due to gas leakage through the gap between the protection plate and the chuck, which affects the filling property of the imprint material.

Innovation Solution

A lithography apparatus design featuring a substrate chuck with a protruding edge that forms a channel with the protection plate, minimizing the gap and reducing gas leakage, while a movable device holds the chuck and substrate stage, allowing for precise control of gas supply and distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a gas is supplied to the substrate and protection plate from a gas supply unit, then the gas flows to the space below the chuck through the gap between the protection plate and chuck, but it becomes difficult to maintain a constant concentration of gas in the space between the mold and substrate

Engineering Contradiction:
Improvegas concentrationVSAvoidconstancy of gas concentration
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The chuck is segmented into different height regions: a first region with a first height and a second region with a second height greater than the first height. This segmentation creates distinct functional zones that control gas flow paths, preventing gas from leaking below the chuck while maintaining constant gas concentration in the imprint space.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention introduces a vertical dimension (height variation) to the chuck structure to solve a horizontal gas leakage problem. By varying the chuck height in different regions, the patent creates a three-dimensional gas flow control system that prevents gas escape through the gap between the protection plate and chuck, thereby maintaining constant gas concentration without increasing supply flow rate.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If the substrate is moved within the plane to perform imprint process in each imprint region, then productivity is improved, but the mold must maintain facing state which complicates the gas concentration control

Engineering Contradiction:
Improveimprint process efficiencyVSAvoidgas concentration control complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The chuck structure with varied heights serves multiple functions: it prevents gas leakage below the chuck, maintains constant gas concentration in the imprint space, and enables the mold to maintain a consistent facing state during substrate movement. This multi-functional design simplifies the overall gas concentration control system while supporting high-productivity multi-region imprint processes.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS10018923B2Lithography apparatus, and method of manufacturing article
Publication Date: 2018.07.10 CANON KK
  • US10018923B2 patent drawing
  • US10018923B2 patent drawing
  • US10018923B2 patent drawing

AI summary

The present invention provides a lithography apparatus that performs patterning on a substrate using an original, the apparatus including a supply device configured to supply a gas to a space between the substrate and the original, a chuck configured to hold the substrate, a movable device that holds the chuck and is movable, and a plate provided on the movable device and surrounding the chuck, wherein the chuck includes a first edge, on a side of the chuck facing the original, protruding toward the plate.