Lithography Component Coatings to Reduce Target Material Buildup

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Solution Overview

Problem

Lithography systems face productivity losses and contamination issues due to target material buildup and contamination, leading to reduced operating efficiency and increased downtime.

Innovation Solution

A nanoscale coating is applied to the surfaces of lithography system components to reduce adhesion and buildup of target material, enhance surface smoothness, and resist thermal damage, thereby minimizing contamination and extending the time between cleaning operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional lithography systems operate without nanoscale coating, then target material adhesion and buildup occur on surfaces, but applying nanoscale coating reduces adhesion and contamination

Engineering Contradiction:

Improveresistance to target material adhesionVSAvoidsurface treatment complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The nanoscale coating acts as a sacrificial protective layer that can be easily removed or regenerated. Rather than attempting to prevent adhesion through complex mechanical means, the patent applies a thin nanoscale coating that provides temporary protection against target material adhesion, and when it degrades or becomes contaminated, it can be removed and reapplied without affecting the underlying substrate.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the surface properties of lithography system components by applying a nanoscale coating with specific physical and chemical parameters. This coating modifies surface energy, roughness, and other parameters to reduce adhesion of target material, transforming the surface characteristics to achieve the desired non-stick property.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If lithography systems require frequent cleaning to remove target material buildup, then contamination is controlled, but productivity and operating efficiency decrease

Engineering Contradiction:

Improveoperating efficiencyVSAvoidtarget material contamination

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The nanoscale coating is applied in advance to surfaces that will be exposed to target material during lithography operations. This preliminary protective action prevents or reduces target material adhesion before contamination can occur, eliminating the need for frequent cleaning interruptions and maintaining continuous high-productivity operation.

Inventive Principle:

Principle #9Preliminary anti-action

Solution Approach 2:

The nanoscale coating serves as an intermediary layer between the target material and the underlying substrate surfaces. This intermediate layer prevents direct contact and adhesion between the target material and critical components, allowing contamination to be minimized without requiring frequent system shutdowns for cleaning.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Duration of action of stationary object

If nanoscale coating is applied to resist thermal damage, then surface durability increases, but manufacturing complexity increases

Engineering Contradiction:

Improvesurface durabilityVSAvoidcoating application complexity

Core Design Contradiction:

Duration of action of stationary objectVSEase of manufacture

Solution Approach 1:

The patent employs a thin nanoscale film coating rather than thick or complex protective structures. This thin film approach provides thermal protection and extends surface durability while minimizing the complexity of the manufacturing process, as thin films can be applied using standard deposition techniques without requiring complex assembly or structural modifications.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The coating reduces target material contamination, increases productivity, and extends the duration between cleaning operations, enhancing semiconductor processing yield and reducing maintenance complexity.

Implementation Method 1

A coating, e.g., a nanoscale coating, on one or more surfaces of one or more components of a lithography system may reduce adhesion of target material to the one or more surfaces

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

The coating may fill in imperfections in the one or more surfaces to reduce surface roughness of the one or more surfaces

Methodology Applied

Scientific EffectSurface smoothing:

Implementation Method 3

The coating may provide resistance against thermal damage to the one or more surfaces

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS12487534B2Semiconductor processing tool and methods of operation

Publication Date: 2025.12.02 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A coating is included on one or more components of a lithography system. The coating reduces surface roughness of the one or more surfaces, increases flatness of the one or more surfaces, and/or increases uniformity of the one or more surfaces. The coating may be formed on the one or more surfaces using one or more of the techniques described herein. The coating is configured to reduce adhesion of target material particles to the one or more surfaces, is configured to resist buildup of target material particles on the one or more surfaces, is configured to provide resistance against oxidation of the one or more surfaces, is configured to resist thermal damage of the one or more surfaces, and/or is configured to enable the lithography system to operate at higher operating temperatures, among other examples.