Lithography Cooling Module Casting for Gap-Free Tube Outlets
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Solution Overview
Problem
The existing methods for manufacturing water-cooled modules in semiconductor lithography, such as those used in EUV and DUV projection systems, result in gaps and surface roughness issues due to differing thermal expansion coefficients of materials, making it difficult to meet cleanliness and positional accuracy requirements.
Innovation Solution
A method involving the use of a sleeve joined to the pipe before casting, ensuring the tube is positioned correctly within the base body, and subsequent melting and machining to create a metallurgical bond and smooth surface finish.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a pipe is cast into the base body using traditional sand casting, then the cooling line can be integrated into the base body, but gaps and surface roughness form at the outlet due to thermal expansion differences and capillary action
Solution Approach 1:
The sleeve is pre-positioned around the pipe before casting, and the pipe is preliminarily fixed in the mold using support structures. This preliminary arrangement ensures that the pipe ends precisely where needed and prevents gap formation during casting, while still allowing post-processing of surfaces.
Solution Approach 2:
The sleeve acts as an intermediary element between the pipe and the base body. It provides a transition zone that allows the pipe to be securely positioned while enabling the base body to be cast around it. The sleeve's inner surface can be post-processed to achieve gap-free connections without affecting the pipe itself.
2Temperature
If the cooling line is made of stainless steel and the base body of aluminum, then thermal conductivity is improved, but thermal expansion differences cause gaps during cooling
Solution Approach 1:
The sleeve serves as a mediator between the stainless steel pipe and the aluminum base body. It accommodates the dimensional changes during cooling and prevents direct contact that would create gaps, while still allowing thermal energy to transfer from the pipe through the sleeve to the base body.
Solution Approach 2:
The design accounts for thermal expansion differences by allowing the aluminum base body to shrink onto the stainless steel pipe during cooling. The sleeve provides a compliant interface that accommodates this differential shrinkage without creating gaps, maintaining both materials' thermal properties.
3Manufacturing precision
If post-processing is performed to remove gaps and rough surfaces, then cleanliness requirements can be met, but the positional accuracy of the cooling line cannot be maintained
Solution Approach 1:
The pipe is preliminarily positioned in the mold using support structures that ensure precise positioning before casting. This preliminary fixation maintains positional accuracy throughout the casting process, and the sleeve allows post-processing of surfaces without moving the pipe from its predetermined position.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures a gap-free, easily cleanable, and precisely positioned cooling system that meets the high standards of semiconductor lithography, enhancing cooling performance and surface quality.
Implementation Method 1
Joining a sleeve to the pipe in the area where the pipe exits the base body, for example by shrink-fitting
Implementation Method 2
the tube, sleeve, and support structures can be at least partially enclosed by the molten metal during casting
Implementation Method 3
a metallurgical bond can be created between the molten metal and the components
Implementation Method 4
the base body shrinks onto the stainless steel cooling line during cooling (in the case of aluminum) due to its higher internal thermal expansion
Data Source
Figure 1
Figure 2
Figure 3a~3b
AI summary
The invention relates to a method for manufacturing a module (40) for semiconductor lithography with a base body (41.2), wherein at least one tube (42) is arranged in the base body (41.2) which penetrates the base body (41.2) at at least one point (45), comprising the following process steps: - joining a sleeve (49.1, 49.2) with the tube (modified) in the area of the exit (45) of the tube (42) from the base body (41.2), - positioning the tube (42) in a mold for manufacturing the base body (41.2), - casting the base body (41.2), - post-processing the base body (41.2). The invention further relates to a module (40) for semiconductor lithography with a base body (41.2), wherein at least one tube (42) is arranged in the base body (41.2) and penetrates the base body (41.2) at at least one point. The module (40) is characterized in that the tube (42) is separated from a sleeve (49.1, 49.2) of the base body (41.2) without a gap.2) is enclosed.