Lithography Component Electret Clamping for Low-Pressure Handling
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Solution Overview
Problem
Lithographic apparatuses operating at low pressures face challenges in securely clamping components like reticles and protective plates without applying unsafe high voltages, and existing solutions like vacuum clamping and mechanical feet lead to contamination and wear.
Innovation Solution
Employ thin-film electret coatings on components to achieve electrostatic adhesion without external forces, utilizing contact electrification or inter-metallic bonding for secure clamping in low-pressure environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum clamping is used to hold components in place, then component positioning is secure, but contamination occurs during cleaning and venting operations
Solution Approach 1:
The patent extracts the harmful vacuum environment from the clamping mechanism by introducing gas pressure to the rear surface of the component. This allows the component to be held securely during normal operation while enabling safe exposure during cleaning and venting operations, as the component is no longer dependent on vacuum for positioning.
Solution Approach 2:
The patent changes the pressure parameter from negative (vacuum) to positive (gas pressure) on the rear surface of the component. This parameter change allows the component to be securely held during imaging operations while enabling safe exposure during maintenance operations, resolving the contradiction between secure positioning and contamination risk.
2Reliability
If electrostatic clamping with high voltages is used to hold components, then component positioning is secure in low pressure, but safety hazards arise during flushing and venting
Solution Approach 1:
The patent replaces the electrostatic field-based clamping system with a gas pressure-based mechanical system. By introducing gas pressure to the rear surface, the component is held securely through mechanical pressure rather than high voltage electrostatic fields, eliminating safety hazards during flushing and venting operations while maintaining secure positioning.
3Object-affected harmful factors
If protective plates are used instead of reticles, then contamination of the support structure is reduced, but component wear increases due to mechanical contact
Solution Approach 1:
The patent replaces mechanical contact-based protective plates with a gas pressure-based holding system. Components are held securely through gas pressure applied to the rear surface without mechanical contact, eliminating wear while maintaining protection during cleaning and venting operations.
4Object-affected harmful factors
If reticles are removed from the support structure during transport, then damage and contamination are prevented, but component positioning accuracy is lost
Solution Approach 1:
The patent extracts the harmful vacuum dependency from the clamping system, allowing components to be securely held during transport through gas pressure rather than vacuum. This enables components to remain installed on the support structure during transport without risk of damage or contamination, while maintaining positioning accuracy through the gas pressure holding mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides safe and reliable clamping of components during operations like flushing, venting, and transport, minimizing contamination and wear, while maintaining component positioning accuracy.
Implementation Method 1
Employ thin-film electret coatings on components to achieve electrostatic adhesion without external forces
Implementation Method 2
utilizing contact electrification or inter-metallic bonding for secure clamping in low-pressure environments
Data Source
AI summary
A method of protecting a component of a lithographic apparatus, the method including the steps of: providing a protective cover which is shaped to protect at least part of said component, the protective cover having a contact surface which is arranged to adhere to a first surface of at least part of said lithographic apparatus or said component; and bringing the protective cover into proximity with the component so as to cause the contact surface to adhere to the lithographic apparatus or said component and remain adhered without the application of external force. It is also provided a patterning device for use in a lithographic apparatus and a lithographic apparatus.

