Lithography Error Diffusion Grid Shift Sub-Pixel Exposure

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Solution Overview

Problem

Current lithography techniques face challenges in achieving high resolution while maintaining process throughput, leading to issues with pixel size truncation and grey-level truncation, which affect critical dimension control and uniformity, and result in increased data volume and cycle time.

Innovation Solution

A data preparation method combining error diffusion and multiple-grid shift techniques is applied to convert IC layout designs into sub-pixel exposure grids, reducing pixel size and grey-level truncation errors, and optimizing data volume without increasing computational requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional lithography techniques are used to improve resolution, then critical dimension control is improved, but process throughput is reduced

Engineering Contradiction:
Improvecritical dimension controlVSAvoidprocess throughput
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent divides the exposure grid into multiple sub-grids and processes them separately using error diffusion algorithms. This segmentation allows parallel processing of different regions, improving throughput while maintaining precision through localized error correction.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies error diffusion and grid shift techniques during the data preparation stage before actual lithography exposure. By pre-correcting pixel size truncation and grey-level truncation errors in the digital domain, the method eliminates the need for slower post-processing adjustments, thereby maintaining both precision and throughput.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If pixel size is reduced to improve resolution, then manufacturing precision is improved, but pixel size truncation error increases

Engineering Contradiction:
Improvecritical dimension controlVSAvoidpixel size truncation error
Core Design Contradiction:
Manufacturing precisionVSMeasurement precision

Solution Approach 1:

The patent converts the harmful pixel size truncation error into a beneficial correction by applying error diffusion algorithms. The algorithm captures the truncation error and redistributes it to neighboring pixels, transforming a source of inaccuracy into a mechanism for maintaining overall pattern fidelity even at reduced pixel sizes.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent changes the parameters of the exposure grid by applying grid shift techniques, which adjust the positioning and scaling of pattern elements. This allows the system to work effectively with reduced pixel sizes while maintaining measurement precision through parameter optimization rather than increasing pixel dimensions.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If grey-level truncation is reduced to improve uniformity, then manufacturing precision is improved, but data volume increases

Engineering Contradiction:
ImproveuniformityVSAvoiddata volume
Core Design Contradiction:
Manufacturing precisionVSQuantity of substance

Solution Approach 1:

The patent extracts and separates the grey-level truncation error component from the overall data set. By identifying and isolating this specific error source, the system can apply targeted error diffusion correction without needing to increase the resolution or detail of the entire data set, thus maintaining uniformity without proportionally increasing data volume.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent applies partial correction strategies where error diffusion is applied selectively to regions with significant grey-level truncation errors rather than uniformly across the entire exposure grid. This partial action approach reduces the computational overhead and data volume requirements while still achieving the necessary uniformity improvement in critical regions.

Inventive Principle:
Principle #16Partial or excessive action

4Manufacturing precision

If data preparation complexity is increased to reduce truncation errors, then manufacturing precision is improved, but cycle time increases

Engineering Contradiction:
Improvetruncation error reductionVSAvoidcycle time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent replaces complex iterative mechanical adjustment processes with efficient error diffusion algorithms that operate in the digital domain. This substitution transforms a time-consuming multi-step correction process into a computationally efficient single-pass algorithm, reducing cycle time while achieving the same level of truncation error reduction.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent performs error diffusion and grid shift corrections during the initial data preparation phase rather than requiring multiple iterative adjustments during subsequent processing stages. This preliminary action consolidates the complexity into a single upfront operation, reducing the overall cycle time by eliminating repeated correction cycles.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20130232455A1Error diffusion and grid shift in lithography
Publication Date: 2013.09.05 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20130232455A1 patent drawing
  • US20130232455A1 patent drawing
  • US20130232455A1 patent drawing

AI summary

The present disclosure involves a method of data preparation in lithography processes. The method of data preparation includes providing an integrated circuit (IC) layout design in a graphic database system (GDS) grid, and converting the IC layout design GDS grid to a second exposure grid by applying an error diffusion and a grid shift technique to a sub-pixel exposure grid.