Automated Corner Rounding Measurement in Lithography Masks
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Solution Overview
Problem
Current methods for measuring corner rounding in semiconductor devices are subjective and time-consuming, relying on manual measurements by human operators, which leads to errors and variations in assessing the lithography process performance.
Innovation Solution
The implementation of novel methods and systems that use lithography masks with corner rounding test patterns, allowing for the measurement of corner rounding through automated analysis of test features using SEM tools, reducing subjectivity and increasing accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual measurement methods are used to measure corner rounding, then the measurement process is simple to implement, but the measurement precision and reliability deteriorate due to subjectivity and human error
Solution Approach 1:
The patent replaces manual mechanical measurement methods with an automated optical measurement system using SEM (scanning electron microscope) imaging and computer-based image analysis. The system automatically captures images of test features and uses software algorithms to measure corner rounding, eliminating human subjectivity and mechanical measurement errors while maintaining ease of implementation through automated workflows
Solution Approach 2:
The patent creates a standardized test feature pattern on the semiconductor device that serves as a reference copy for measurement. This test pattern is specifically designed with known geometric characteristics that can be imaged and analyzed to determine corner rounding, providing a consistent measurement target that eliminates variability in manual measurement approaches
2Device complexity
If manual measurement methods are used to measure corner rounding, then the equipment requirements are minimal, but the productivity deteriorates due to time-consuming manual processes
Solution Approach 1:
The patent implements an automated measurement system that continuously captures SEM images and processes measurements without interruption. The system automatically sequences through multiple test features, continuously acquiring images and calculating corner rounding values, eliminating the stop-start nature of manual measurement and significantly increasing measurement throughput
Solution Approach 2:
The measurement system is designed to be self-operating, with automated image capture, automated image processing, and automated calculation of corner rounding values. The system performs all measurement functions without requiring continuous human intervention, allowing a single operator to manage multiple measurements and increasing overall productivity
3Measurement precision
If standardized test patterns are implemented for automated measurement, then the measurement precision improves, but the device complexity increases due to additional mask patterns and analysis systems
Solution Approach 1:
The patent separates the measurement function into a dedicated test feature region on the semiconductor device, distinct from production areas. The mask contains specific test patterns isolated in a test region, allowing automated measurement without interfering with production workflows. This segmentation enables precise measurement while keeping the overall system architecture simple and modular
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise and efficient measurement of corner rounding, minimizing operator error and reducing the time required for assessments, thereby improving the accuracy and reliability of lithography process evaluations.
Implementation Method 1
Optical photolithography involves projecting or transmitting light through a pattern made of optically opaque or translucent areas and optically clear or transparent areas on a mask or reticle onto a layer of photosensitive material deposited over a wafer
Implementation Method 2
Current methods of measuring corner rounding involve taking a scanning electron microscope (SEM) image or photograph from a top view of a semiconductor device having functioning features formed therein
Data Source
AI summary
Metrology systems and methods for lithography processes are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a mask having a plurality of corner rounding test patterns formed thereon. A first semiconductor device is provided, and a layer of photosensitive material of the first semiconductor device is patterned with a plurality of corner rounding test features using the mask and a lithography process. An amount of corner rounding of the lithography process is measured by analyzing the plurality of corner rounding test features relative to other of the plurality of corner rounding test features formed on the layer of photosensitive material of the semiconductor device. The lithography process or the mask is altered in response to the amount of corner rounding measured, and a second semiconductor device is provided. The second semiconductor device is affected using the altered lithography process or the altered mask.