Lithography Mirror Arrangement With Insert-Opening Beam Dumps
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Solution Overview
Problem
Existing lithography systems face challenges in effectively absorbing unwanted radiation without significantly influencing the optical performance of the mirror arrangement, particularly due to limited switching ranges of mirror elements and potential thermal deformation of mount arrangements.
Innovation Solution
A mirror arrangement is designed with insert openings that accommodate either no carrier element or a dummy carrier element, serving as beam dumps to absorb unwanted radiation. This design incorporates a channel device for coolant guidance to efficiently dissipate heat, maintaining minimal thermal deformation and optical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a separate beam dump is added to absorb unwanted radiation, then radiation absorption capability is improved, but device complexity and space requirements increase
Solution Approach 1:
The patent merges the beam dump function with the existing mount arrangement by utilizing the insert openings that are already present for accommodating carrier elements. The mount arrangement structure itself serves dual purposes: mechanical support for mirrors and radiation absorption through the insert openings, eliminating the need for a completely separate beam dump component.
Solution Approach 2:
The insert openings in the mount arrangement are designed to serve multiple functions: they accommodate carrier elements when needed and simultaneously act as beam dumps to absorb unwanted radiation when carrier elements are not present. This multi-functionality reduces overall system complexity while maintaining both mechanical support and radiation absorption capabilities.
2Object-affected harmful factors
If mirror elements are positioned closer to the beam dump, then radiation absorption efficiency is improved, but thermal deformation of the mount arrangement increases
Solution Approach 1:
The patent extracts the thermal management function from the mechanical support structure by introducing a separate cooling channel system within the mount arrangement. This allows the mount arrangement to be thermally managed independently, enabling closer positioning of mirror elements to the beam dump without excessive thermal deformation affecting optical performance.
Solution Approach 2:
The cooling channel system acts as an intermediary thermal management mechanism between the beam dump and the mount arrangement. It facilitates heat removal from the beam dump region, preventing thermal deformation of the mount arrangement and allowing optimal positioning of optical components for maximum radiation absorption efficiency.
3Ease of manufacture
If the switching range of mirror elements is limited, then manufacturing complexity is reduced, but radiation absorption capability is worsened
Solution Approach 1:
The patent uses dummy carrier elements that replicate the structural presence of functional carrier elements without containing actual mirror elements. These dummy carrier elements occupy the same positions in the grid arrangement, allowing the mount arrangement to be configured for optimal radiation absorption while the actual mirror elements maintain their limited switching range without compromising the overall system performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for effective absorption of unwanted radiation while maintaining the optical performance of the mirror arrangement by preventing significant thermal deformation of the mount arrangement, thus ensuring accurate reflection of incident radiation.
Implementation Method 1
For absorbing incident radiation, at least one of the insert openings does not accommodate a carrier element (and no dummy carrier element either) and/or wherein, for absorbing incident radiation, at least one of the insert openings accommodates a dummy carrier element which does not carry a mirror element
Implementation Method 2
This design incorporates a channel device for coolant guidance to efficiently dissipate heat, maintaining minimal thermal deformation and optical performance
Implementation Method 3
a plurality of mirror elements for reflecting radiation
Data Source
AI summary
A mirror arrangement, such as for a lithography system, comprises: a plurality of mirror elements for reflecting radiation; a plurality of carrier elements, which each carry one of the mirror elements; and a mount arrangement having insert openings formed in each case to accommodate a respective one of the carrier elements, with the plurality of carrier elements, which each carry one of the mirror elements, being accommodated in the insert openings of the mount arrangement. For absorbing radiation, at least one of the insert openings does not accommodate a carrier element and/or, for absorbing radiation, at least one of the insert openings accommodates a dummy carrier element which does not carry a mirror element.