Lithography Process Condition Pre-Compensation Method
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Solution Overview
Problem
The existing lithography process requires significant time and labor to determine optimum process conditions for new products, with existing methods either failing to pre-estimate focal distance or relying on subjective personal experience, leading to inefficiencies in trial production and accuracy.
Innovation Solution
A method using pre-compensation values to quickly establish lithography process conditions by calculating defocus and exposure amount ratios based on reference process conditions, allowing for the rapid determination of optimum process conditions for masks with the same parameters, thereby reducing trial production time and improving production capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a focal distance-energy matrix is made for each mask to determine optimum process conditions, then the accuracy of process conditions is improved, but the time and labor required increase significantly
Solution Approach 1:
The patent applies preliminary action by pre-establishing a database of process conditions for multiple mask types in advance. When a new mask is introduced, the system retrieves and applies pre-determined process conditions from the database rather than performing a complete focal distance-energy matrix analysis, significantly reducing the time required while maintaining accuracy through the use of pre-validated parameters.
Solution Approach 2:
The patent uses copying by creating a database that stores process condition data from reference masks. These stored conditions are then copied and applied to new masks with similar parameters, eliminating the need to recreate the entire optimization process for each new mask while preserving the accuracy of the original measurements.
2Loss of time
If pre-estimation of exposure energy is performed based on linewidth size error, then the time required is reduced, but the ability to pre-estimate focal distance is lost
Solution Approach 1:
The patent implements universality by creating a comprehensive database that stores both exposure energy and focal distance parameters for multiple mask types. This multi-functional database allows the system to retrieve both parameters simultaneously when determining process conditions for new masks, maintaining the ability to estimate both exposure energy and focal distance while reducing time requirements.
3Ease of operation
If process conditions are pre-estimated only from personal experience, then the process is simplified, but subjective errors increase and theoretical support is lacking
Solution Approach 1:
The patent applies self-service by implementing an automated system that retrieves process conditions from a database based on mask parameter matching. The system independently determines optimal process conditions without relying on human operators' subjective judgment, eliminating personal bias while maintaining operational simplicity through automated parameter retrieval and application.
4Manufacturing precision
If different masks use different process conditions to account for substrate and fabrication differences, then the quality of lithography results is improved, but the complexity of managing process conditions increases
Solution Approach 1:
The patent uses parameter changes by organizing the database to store process conditions as variable parameters that can be automatically adjusted based on mask characteristics. The system retrieves base parameters from the database and modifies them according to specific mask parameters, allowing customized process conditions for different masks while managing complexity through systematic parameter organization and automated retrieval.
Data Source
AI summary
The present invention discloses a method for quickly establishing lithography process condition by a pre-compensation value, comprising: firstly determining a reference process condition of masks of which parameters are same, and then determining an optimum process condition of the first mask; thereafter, calculating a ratio of the optimum process condition of the first mask deviating from the reference process condition, wherein if the ratio is equal to or larger than a set threshold, the first mask is inspected, and if the ratio is less than the set threshold, an optimum process condition of the second mask is determined according to the ratio and the reference process condition of the second mask; and by analogy, determining optimum process conditions of the rest masks. The method of the present invention can quickly establish a lithograph process condition, reduce the trial production time for determining the optimum defocus amount and exposure amount.