Lithography Sensor Subframe Integration for Position Accuracy

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Solution Overview

Problem

In EUV and DUV lithography systems, the use of multiple sensor subframes leads to measurement inaccuracies and alignment errors due to the complexity of referencing between them, resulting in image oscillations and measurement errors that affect the positioning of optical elements and wafers.

Innovation Solution

A lithography system with a single integrated sensor subframe that detects the position of optical elements and wafers relative to it, reducing the need for inter-subframe referencing and minimizing measurement errors by compensating for position inaccuracies through LoS sensitivity compensation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of stationary object

If multiple sensor subframes are used to detect positions, then the sensor subframes can have smaller dimensions or reduced mass, but measurement inaccuracies and alignment errors increase due to the complexity of referencing between them

Engineering Contradiction:
Improvesensor subframe massVSAvoidposition detection accuracy
Core Design Contradiction:
Weight of stationary objectVSMeasurement precision

Solution Approach 1:

The patent merges multiple sensor subframes into a single integrated sensor frame that detects positions of all optical elements and the wafer. This eliminates the need for inter-subframe referencing, thereby removing measurement inaccuracies and alignment errors while maintaining the reduced mass benefit through optimized single-frame design

Inventive Principle:
Principle #5Merging (Combining)

2Adaptability or versatility

If multiple sensor subframes are used, then position detection coverage is improved, but the complexity of referencing between subframes increases leading to measurement errors

Engineering Contradiction:
Improveposition detection coverageVSAvoidreferencing complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple sensor subframes into one unified sensor frame that provides comprehensive position detection for all optical elements and the wafer. This single-frame approach maintains full detection coverage while eliminating the complex referencing relationships between multiple subframes

Inventive Principle:
Principle #5Merging (Combining)

3Measurement precision

If multiple sensor subframes are used, then position detection capability is enhanced, but alignment errors between subframes occur

Engineering Contradiction:
Improveposition detection capabilityVSAvoidalignment accuracy
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent integrates multiple sensor subframes into a single sensor frame, ensuring that all position measurements are referenced to the same stable coordinate system. This eliminates alignment errors between subframes while preserving the enhanced position detection capability through the unified frame's multiple sensors

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS10635003B2Lithography system and method
Publication Date: 2020.04.28 CARL ZEISS SMT GMBH
  • US10635003B2 patent drawing
  • US10635003B2 patent drawing
  • US10635003B2 patent drawing

AI summary

A lithography system has a projection lens that includes a first optical element and a first sensor subframe. The projection lens also includes first sensor which is configured to detect a position of the first optical element with respect to the first sensor subframe. The projection lens further includes a second sensor which is configured to detect a position of a wafer with respect to the first sensor subframe.