Lithography Shot Shape Correction for Continuous Shot Region Joints

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Solution Overview

Problem

Existing exposure methods fail to adequately correct the connection state between adjacent shot regions with non-linear shapes, which can adversely affect the electrical characteristics of chips, especially in large substrates where exposure regions are divided into multiple shot regions.

Innovation Solution

A computer-readable storage medium and lithography apparatus that generate control information to correct the higher-order shapes of shot regions by matching their outer peripheral portions and adjust parameters such as shift, rotation, and magnification to ensure continuous joints between shot regions, using techniques like least-squares method for optimal alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If exposure region is divided into multiple shot regions for large substrates, then productivity is improved by enabling exposure of large areas, but manufacturing precision deteriorates due to poor connection state between adjacent shot regions

Engineering Contradiction:
Improveexposure capability for large substratesVSAvoidconnection state between shot regions
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent performs preliminary measurement of the lower layer shot region shape before upper layer exposure, and pre-calculates the optimal shape for each shot region to ensure continuous connection. By obtaining deviation information from the lower layer and determining correction amounts in advance, the system eliminates connection errors that would otherwise occur during multi-shot exposure of large substrates.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements a feedback mechanism where the actual shape of the lower layer shot region is measured and used to determine the optimal shape of upper layer shot regions. The system feeds back the deviation information from the lower layer to adjust and correct the upper layer shot region shapes, ensuring continuous connection between adjacent shots.

Inventive Principle:
Principle #23Feedback

2Ease of manufacture

If conventional linear correction method is used for shot region connection, then ease of manufacture is maintained with simple correction processes, but manufacturing precision deteriorates when connecting portions have non-linear higher-order shapes

Engineering Contradiction:
Improvesimplicity of correction processVSAvoidconnection accuracy for non-linear shapes
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent changes the correction approach from simple linear parameter adjustment to comprehensive shape parameter optimization. By determining the optimal shape of each shot region based on lower layer deviation information, the system accounts for non-linear higher-order shape variations including curvature and irregularities, achieving accurate connection for complex geometries.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent explicitly addresses non-linear higher-order shapes including curved connecting portions between shot regions. By determining optimal shot region shapes that account for curvature and non-linear deviations from the lower layer, the system achieves continuous connection even when connecting portions have complex curved geometries rather than simple linear boundaries.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Data Source

PatentUS20250370348A1Storage medium, lithography method, information processing apparatus, lithography apparatus, and article manufacturing method
Publication Date: 2025.12.04 CANON KK
  • US20250370348A1 patent drawing
  • US20250370348A1 patent drawing
  • US20250370348A1 patent drawing

AI summary

A computer-readable storage medium storing a program for causing a computer to execute a method for generating control information on a lithography apparatus is provided. The lithography apparatus is configured to correct at least one of first and second shot regions of a substrate such that an outer peripheral portion of the first shot region and an outer peripheral portion of the second shot region match at least at one point. The program causes the computer to execute obtaining information on a deviation amount with respect to an ideal shape of a shot region of a lower layer, and generating control information including correction information for correcting a higher-order shape of the at least one of the first and second shot regions to be formed at an upper layer based on information on the deviation amount.