Lithography Shot Layout for Effective Chip Alignment Setting
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Solution Overview
Problem
Existing semiconductor exposure equipment lacks the ability to optimize exposure conditions specifically for effective chip regions, particularly in imperfect shot regions at the outer circumferential part of the substrate, requiring significant time for manual adjustments.
Innovation Solution
A lithography information processing apparatus that displays the layout of shot regions and positions of effective chips within each shot region, enabling automatic selection and display of alignment marks for efficient recipe setting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If exposure conditions are optimized for each shot region considering effective chip regions, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The substrate is divided into multiple shot regions, and each shot region is further segmented into effective chip regions and ineffective regions. This segmentation allows independent optimization of exposure conditions for each effective chip region while maintaining manageable complexity through systematic organization.
Solution Approach 2:
Different exposure conditions are applied to different effective chip regions within shot regions based on their specific requirements. The system identifies and treats effective chip regions differently from ineffective regions, applying localized optimization strategies to improve manufacturing precision where needed.
2Manufacturing precision
If manual adjustment of exposure conditions is performed for each shot region, then manufacturing precision is improved, but loss of time increases
Solution Approach 1:
The system pre-identifies effective chip regions and ineffective regions before exposure condition optimization. By preparing the shot region classification and effective region identification in advance, the system reduces the time required for manual adjustment and enables more efficient recipe setting.
Solution Approach 2:
The system automatically identifies effective chip regions and classifies shot regions based on predefined criteria, reducing the need for manual analysis. This self-service capability accelerates the optimization process while maintaining precision by systematically evaluating each region's characteristics.
3Device complexity
If all shot regions are treated uniformly, then device complexity is reduced, but manufacturing precision deteriorates
Solution Approach 1:
The system segments shot regions into effective and ineffective regions based on chip acquisition capability. This segmentation enables differentiated treatment of regions while maintaining an organized structure that prevents excessive complexity, allowing precise optimization where needed without oversimplifying the overall process.
Solution Approach 2:
The system applies different exposure conditions to different effective chip regions based on their specific requirements. By identifying and treating effective chip regions differently from ineffective regions, the system achieves localized optimization without requiring complete redesign of the entire exposure process.
Data Source
AI summary
In order to provide a lithography information processing apparatus that can optimize, for example, adjustment of alignment at an outer circumferential part of a substrate, the lithography information processing apparatus includes a display control unit that causes a layout of a shot region of the substrate used in a lithography apparatus to be displayed and causes a position of an effective chip in each of the shot regions to be displayed according to the number of chips included in each of the shot regions.