Laser Interference Lithography Stitching Large Exposure Areas

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Solution Overview

Problem

Conventional laser interference lithography apparatuses face challenges in manufacturing large-scale polarizers due to high manufacturing costs and instability caused by gravity affecting the moving platform, which requires high-power lasers and fixed vertical wafers.

Innovation Solution

A laser interference lithography apparatus with a movable and rotatable reflecting mechanism, an L-shaped fixing mechanism, and a horizontally positioned substrate stage, allowing for low-power laser use and reduced gravity influence, enabling the creation of stable large-area interference patterns by stitching small exposed areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If a high-power laser source and large-scale collimator are employed to manufacture large-scale imprinting molds, then the large-area interference patterns can be obtained, but the manufacturing cost increases and the laser beam angle cannot be easily adjusted

Engineering Contradiction:
Improveexposure areaVSAvoidlaser system complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent divides the large-area exposure into multiple small exposed areas that are stitched together to form the complete large-area interference pattern. This segmentation allows the use of simpler, lower-power laser systems while achieving large-scale mold manufacturing capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a movable and rotatable reflecting mechanism that adds rotational freedom to the laser beam path. This allows the laser beam angle to be easily adjusted in multiple dimensions, enabling flexible stitching of multiple exposure areas without requiring complex high-power laser systems.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of operation

If the wafer or substrate is fixed vertically in the conventional laser interference lithography apparatus, then the exposure process can be performed, but the moving platform is influenced by gravity force causing exposure system instability

Engineering Contradiction:
Improvesubstrate positioningVSAvoidexposure system stability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent inverts the conventional vertical substrate positioning to a horizontal configuration. By fixing the substrate horizontally instead of vertically, the moving platform is no longer subjected to gravitational influence, thereby eliminating the stability issues while maintaining ease of operation.

Inventive Principle:
Principle #13The other way round (Inversion)

3Productivity

If high-power laser is used to achieve large-area exposure, then the exposure speed is maintained, but the manufacturing cost increases

Engineering Contradiction:
Improveexposure speedVSAvoidmanufacturing cost
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The patent segments the large-area exposure into multiple smaller exposure regions that are processed sequentially and stitched together. This allows the use of lower-power, more cost-effective laser systems while maintaining overall productivity through automated stitching of the multiple exposure areas.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs periodic action through the movable and rotatable reflecting mechanism that systematically directs the laser beam across multiple exposure areas in a structured sequence. This periodic scanning approach enables comprehensive large-area exposure using lower-power lasers, reducing manufacturing costs while maintaining exposure speed.

Inventive Principle:
Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus achieves cost-effective production of high-quality large-area interference patterns, reducing manufacturing costs and stabilizing the exposure system by using a low-power laser and horizontal substrate positioning, facilitating the creation of large-area imprinting molds.

Implementation Method 1

A first portion of the laser beam is reflected, by the reflecting mechanism and the first reflecting mirror, to the mask

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

the first portion and the second portion of the laser beam generate an interference pattern on a pattern layer of the substrate

Methodology Applied
Scientific EffectInterference: Interference

Data Source

PatentUS8400616B2Laser interference lithography apparatus capable of stitching small exposed areas into large exposed area
Publication Date: 2013.03.19 NATIONAL TSING HUA UNIVERSITY
  • US8400616B2 patent drawing
  • US8400616B2 patent drawing
  • US8400616B2 patent drawing

AI summary

A laser interference lithography apparatus capable of stitching small exposed areas into a large exposed area includes a body, a laser beam supplying unit, a reflecting mechanism, an L-shaped fixing mechanism and a substrate stage. The laser beam supplying unit fixed onto the body provides a laser beam. The reflecting mechanism is movably and rotatably mounted on the body. The L-shaped fixing mechanism mounted on the body includes a first mounting seat and a second mounting seat. An upright first reflecting mirror is fixed to the first mounting seat. The second mounting seat connected to the first mounting seat fixes a horizontal mask, and is substantially perpendicular to the first mounting seat. The substrate stage, movably mounted on the body and disposed below the second mounting seat, supports a substrate. Thus, a large-area pattern formed by stitching small-area patterns may be obtained.