Lithography System Parallel Modules Vacuum Footprint
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving high throughput and maintaining low capital and operational costs while minimizing the footprint of wafer processing equipment in clean room environments, as newer lithography systems with higher precision often result in reduced processing speed and require significant adjustments to existing infrastructure.
Innovation Solution
A lithography system design featuring a plurality of units with a charged particle lithography apparatus in a vacuum chamber, integrated load lock and door systems for easy servicing, and a substrate supply and transfer system to maintain high throughput and reduce downtime, allowing for direct access and efficient use of space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If newer lithography systems with higher precision are introduced, then manufacturing precision is improved, but productivity deteriorates due to reduced processing speed
Solution Approach 1:
The lithography system is divided into multiple independent processing modules (first lithography module, second lithography module, third lithography module) that can operate simultaneously on different substrates or different regions. This parallel processing architecture enables high-precision patterning to be performed on multiple substrates at the same time, thereby maintaining productivity while achieving improved manufacturing precision through the advanced capabilities of each individual module
2Area of stationary object
If lithography systems are arranged in a compact configuration, then area is reduced, but ease of operation deteriorates due to limited access for servicing
Solution Approach 1:
The system utilizes three-dimensional spatial arrangement where lithography modules are positioned at different heights and angles around a central substrate transfer system. The fourth lithography module is positioned above the substrate transfer system, utilizing vertical space rather than only horizontal plane. This multi-dimensional configuration reduces the horizontal footprint while maintaining excellent accessibility for servicing all modules from various directions
3Productivity
If multiple lithography modules are integrated in a single system, then productivity is improved through parallel processing, but device complexity increases
Solution Approach 1:
Multiple lithography modules share common infrastructure including the vacuum chamber, substrate transfer system, and control systems. Each module is designed with standardized interfaces and configurations, allowing them to perform the same lithography function while sharing resources. This universality reduces overall system complexity compared to having separate independent systems, while still achieving high productivity through parallel processing capabilities
Solution Approach 2:
The system merges multiple lithography modules into a single integrated platform with shared vacuum environment and substrate handling mechanisms. The first, second, third and fourth lithography modules are combined within a common system architecture, eliminating the need for separate vacuum chambers and transfer systems for each module, thereby reducing overall complexity while maintaining high throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables high throughput and efficient servicing of lithography systems, reducing downtime and operational costs while maintaining a compact footprint, allowing for seamless integration into existing processing lines without major adjustments.
Implementation Method 1
a charged particle lithography apparatus, arranged in a vacuum chamber for patterning a substrate
Data Source
Figure 1
Figure 2a
Figure 2b
AI summary
The invention relates to a lithography system (300) comprising a plurality of lithography system units. Each lithography system unit comprises a lithography apparatus (301) arranged in a vacuum chamber for patterning a substrate; a load lock system (310) for transferring substrates into and out of the vacuum chamber; and a door for enabling entry into the vacuum chamber for servicing purposes. The load lock system and the door of each lithography system unit are provided at the same side and face a free area at a side of the lithography system, in particular the service area (305).