Lithography Template Heating via Segmented Gas Zones

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Solution Overview

Problem

In the manufacturing of lithography templates for nanoimprint, existing methods face challenges in achieving uniform temperature distribution across the substrate, leading to non-uniform film thickness and reduced manufacturing throughput due to inefficient heating of the central and peripheral regions.

Innovation Solution

A substrate processing apparatus is designed with a substrate support having a protruding portion and a bottom portion, where a first hot gas is supplied to a space defined by these structures to heat the non-contacting region of the substrate, ensuring uniform temperature distribution across the substrate by convection and thermal conduction, while a second hot gas is used in the process chamber for film formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional heating methods are used for substrate processing, then the substrate can be heated, but the temperature distribution across the substrate becomes non-uniform

Engineering Contradiction:
Improvetemperature distribution uniformityVSAvoidfilm thickness uniformity
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The heating system is segmented into two independent zones: a first hot gas supply system for the central region (through the protruding portion) and a second hot gas supply system for the peripheral region (in the process chamber). This segmentation allows independent temperature control of different substrate regions, resolving the non-uniform temperature distribution problem.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different heating methods are applied to different regions of the substrate: convection heating via hot gas supply is used for the central region, while conduction heating through the substrate support is used for the peripheral region. This local differentiation of heating quality achieves uniform temperature distribution across the entire substrate surface.

Inventive Principle:
Principle #3Local quality

2Temperature

If heating time is extended to achieve uniform temperature distribution, then temperature uniformity improves, but manufacturing throughput decreases

Engineering Contradiction:
Improvetemperature distribution uniformityVSAvoidmanufacturing throughput
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The heating process is segmented into two simultaneous heating zones, allowing the entire substrate to be heated in parallel rather than sequentially. This reduces the total heating time required to achieve uniform temperature distribution, thereby maintaining high manufacturing throughput.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Both hot gas supply systems operate simultaneously and continuously during the heating process, ensuring that the entire substrate receives heating input at the same time. This continuous parallel action eliminates waiting periods and extends the useful heating action across the whole substrate, reducing overall processing time.

Inventive Principle:
Principle #20Continuity of useful action

3Ease of operation

If the substrate is fully supported on the substrate support, then handling is simplified, but heating efficiency and temperature uniformity deteriorate

Engineering Contradiction:
Improvesubstrate handlingVSAvoidheating efficiency
Core Design Contradiction:
Ease of operationVSTemperature

Solution Approach 1:

The substrate support structure is segmented with a protruding portion that creates a suspended central region. This segmentation allows the central part of the substrate to be heated by hot gas convection while the peripheral parts are supported for stable handling, combining the advantages of both full support and suspended heating.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The protruding portion acts as an intermediary structure that provides mechanical support for easy substrate handling while simultaneously creating a controlled heating environment for the central region. It mediates between the conflicting requirements of full support for handling and suspension for heating efficiency.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a uniform temperature distribution across the substrate, improving the uniformity of film thickness and increasing manufacturing throughput by effectively heating both the central and peripheral regions, thereby enhancing the quality of the lithography template.

Implementation Method 1

heating the substrate by supplying a first hot gas into a space defined by the protruding portion and the bottom portion

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

heating the non-contacting region of the substrate, ensuring uniform temperature distribution across the substrate by convection and thermal conduction

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

supplying a second hot gas into the process chamber

Methodology Applied
Scientific EffectHeating: Heating

Data Source

PatentUS10883172B2Method of manufacturing lithography template
Publication Date: 2021.01.05 KOKUSAI DENKI KK
  • US10883172B2 patent drawing
  • US10883172B2 patent drawing
  • US10883172B2 patent drawing

AI summary

Described herein is a technique capable of improving the quality of a template. According to the technique described herein, there is provided a method of manufacturing a lithography template, including: (a) loading a substrate into a process chamber, the substrate having a pattern region and a non-contacting region at center and peripheral portions thereof, respectively; (b) placing the substrate on a substrate support having a protruding portion and a bottom portion such that a back surface of the non-contacting region of the substrate is supported by the protruding portion; (c) heating the substrate by supplying a first hot gas into a space defined by the protruding portion and the bottom portion while supplying a second hot gas into the process chamber; and (d) processing the substrate after performing (c) by supplying a process gas into the process chamber while supplying the first hot gas into the space.