Load-Balanced Clamp Frame for Uniform IC Heatsink Loading
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Solution Overview
Problem
Conventional chip packaging schemes face high risks of IC die edge cracking during heatsink or cold-plate assembly and disassembly due to non-uniform loading, which is exacerbated by the need for incremental screw tightening to avoid damage, leading to operator-dependent assembly challenges.
Innovation Solution
A load frame with a load balanced clamp system that simultaneously applies equal forces to opposite sides of the IC device using actuators and spring members, such as torsion springs, to clamp the heatsink or secure the IC device in a socket, ensuring balanced and synchronized loading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional integrated spring-load screws/nuts are used to load the heatsink, then the heatsink can be secured to the IC dies, but non-uniform loading occurs causing IC die edge cracking
Solution Approach 1:
The single-point screw loading is segmented into multiple distributed loading points. The patent uses a load frame with multiple actuators (at least two) that apply force at different locations on the heatsink, distributing the loading across multiple points rather than concentrating it at a single screw location. This segmentation prevents non-uniform stress concentration that causes edge cracking.
Solution Approach 2:
Multiple loading operations are merged into a single simultaneous action. The patent employs a load frame where multiple actuators are coordinated to apply loading forces simultaneously to the heatsink, combining what would otherwise be sequential screw-tightening operations into one synchronized event. This ensures uniform force distribution across all loading points at the same time.
2Object-affected harmful factors
If incremental screw tightening is performed to reduce maximum pressure on IC dies, then operator-dependent damage reduction is achieved, but assembly complexity and time increase
Solution Approach 1:
The loading sequence is predetermined and automated by the load frame system. Instead of relying on operator judgment to incrementally tighten screws, the load frame is pre-configured with multiple actuators positioned to apply force in a specific sequence or simultaneously. This preliminary arrangement of loading points and automated control eliminates the need for operator-dependent incremental tightening, maintaining safety while improving efficiency.
Solution Approach 2:
The load frame system performs the loading operation autonomously without requiring operator intervention for force distribution. The actuators are designed to automatically apply uniform force across multiple points, with the system self-regulating the loading process. This eliminates the need for operators to manually control tightening increments, freeing them from complex manual procedures while ensuring consistent results.
3Stability of the object's composition
If multiple screws are used to load the heatsink at different locations, then heatsink stability is improved, but non-uniform loading and tilting occur
Solution Approach 1:
The load frame creates equipotential loading conditions by ensuring all actuators apply force to the heatsink simultaneously and uniformly. The system is designed so that all loading points reach their designated force levels at the same time, eliminating potential differences in force application that would cause tilting. This equipotential approach maintains heatsink stability while ensuring uniform stress distribution across all IC dies.
4Adaptability or versatility
If operator skill is relied upon to avoid IC die cracking during manual assembly, then flexibility is maintained, but consistency and reliability decrease
Solution Approach 1:
The load frame system performs the critical force-distribution function autonomously without requiring operator skill or judgment. The actuators are programmed or mechanically designed to apply uniform force automatically, making the system self-sufficient for the loading operation. This maintains operational flexibility while ensuring consistent, reliable results independent of operator capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The load frame mitigates IC die edge damage by eliminating operator-induced errors and ensuring uniform force application, reducing the risk of cracking and improving assembly efficiency.
Implementation Method 1
The first actuator is coupled to the first and second clamps by spring members. The spring members may be torsion springs, coil springs, spring forms, stretchy cables, and the like.
Data Source
AI summary
A load frame with a load balance clamp and electronic devices having the same are disclosed herein. The load frame is configured to simultaneously apply clamping forces to opposite sides an integrated circuit (IC) device, thus reducing potential damage to components of the IC device. In one example, a load frame includes a base, first and second clamps, and a first actuator. The base includes an open central region configured to receive an IC device. The first and second clamps are disposed on opposite sides of the open central region. The first actuator is operable to cause the first and second clamps to simultaneously clamp the IC device in the central region.