Load Drive Current Distribution for Heat-Constrained PCB Modules
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Solution Overview
Problem
Conventional load drive devices experience increased power consumption and heat generation with rising input voltage, necessitating a large print-circuit board area, making them difficult to install in compact modules.
Innovation Solution
A load drive device with a current distributor that sums input currents at a prescribed distribution ratio, controlled by a controller to manage power consumption, using external resistors to distribute power consumption and reduce internal heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the input voltage Vin rises, then the power consumption Pc increases, but the heat generation becomes large requiring a large print-circuit board area
Solution Approach 1:
The patent divides the single input current path into two separate input terminals (first input terminal and second input terminal), each accepting input current independently. The current distributor then segments the total output current by summing these input currents at a prescribed distribution ratio, effectively splitting the power consumption path to reduce heat concentration in one location.
Solution Approach 2:
The patent introduces an external resistor as an intermediary element connected to the second input terminal. This external resistor absorbs part of the power consumption externally, preventing it from being converted into heat within the load drive device itself, thus reducing the heat generation problem while still allowing the device to function properly.
2Device complexity
If the power consumption is concentrated in one device, then the device can be simple, but the print-circuit board area must be large for heat dissipation
Solution Approach 1:
The patent extracts part of the power consumption function from the load drive device by introducing a second input terminal connected through an external resistor. This external resistor takes out a portion of the power dissipation requirement from the device itself, allowing the device to maintain a simple structure while reducing the heat generation that would otherwise require a large print-circuit board area for dissipation.
3Reliability
If output feedback control is used to keep output current constant, then the output current is stable, but the power consumption increases with input voltage
Solution Approach 1:
The patent introduces dynamic control through the controller that adjusts the distribution ratio between the two input current paths based on operating conditions. This dynamic adjustment allows the system to maintain stable output current while optimizing power consumption by varying how the input currents are distributed, preventing excessive power consumption even when input voltage rises.
Data Source
AI summary
A semiconductor device, and an electronic module including the semiconductor device, are described. In an example, the semiconductor device includes a first voltage side terminal arranged to be connected to an external first voltage, a second voltage side terminal arranged to be connected to an external second voltage different from the external first voltage, and a terminal which is adjacent to the first voltage side terminal and is arranged to be connected to one terminal of an external resistor. A current distributor is configured to distribute a current to a direct path to the first voltage side terminal and to a loss path to the terminal. A current driver is configured to perform current control of a current including a current between the first voltage side terminal and the second voltage side terminal.