Multi-Level Load-Lock Carrier Layout for Low-Particle Vapor Deposition
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Solution Overview
Problem
The existing vapor deposition devices face issues with particle generation due to the ring-shaped carrier transferring between chambers, leading to deteriorated Light Point Defect (LPD) quality, particularly in multi-stage load-lock chamber configurations.
Innovation Solution
A vapor deposition device design featuring a ring-shaped carrier that supports the outer edge of wafers, utilizing multiple carriers and robots to manage wafer transport between storage, load-lock, and reaction chambers, with specific door and gate valve configurations to minimize particle adherence and improve LPD quality by ensuring the before-treatment wafer is mounted on the topmost-level holder in the load-lock chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the load-lock chamber is configured in multiple stages to save space and improve productivity, then productivity and space utilization are improved, but particle generation increases and LPD quality deteriorates
Solution Approach 1:
The patent introduces a vertical dimension by placing holders at different heights (first holder at upper level, second holder at lower level) within the load-lock chamber. This vertical arrangement allows multiple carriers to be stored without increasing horizontal space, while the upper position of the first holder prevents carriers from the second holder from falling and contaminating wafers, thus resolving the contradiction between space utilization and particle generation.
Solution Approach 2:
The load-lock chamber is segmented into multiple levels with distinct holders (first holder and second holder) at different heights. This segmentation allows independent positioning and management of carriers, enabling the system to maintain high productivity through efficient space utilization while preventing particle contamination by isolating carriers at different vertical levels.
2Ease of operation
If carriers are transferred via the reaction chamber, then wafer transport is enabled, but particle generation occurs and LPD quality deteriorates
Solution Approach 1:
The patent extracts the carrier storage and transfer function from the reaction chamber by introducing a dedicated load-lock chamber with multiple holders. Carriers are now loaded and stored in the load-lock chamber before being transferred to the reaction chamber, separating the storage function from the processing function and preventing particle generation in the reaction chamber while maintaining ease of wafer transport.
Solution Approach 2:
The load-lock chamber acts as an intermediary between the wafer storage container and the reaction chamber. Carriers are prepared and stored in the load-lock chamber (with the first holder at upper level and second holder at lower level) before being transferred to the reaction chamber, serving as a buffer zone that enables smooth wafer transport while preventing particle contamination of the wafers.
3Area of stationary object
If the first holder supports carriers at upper level, then space utilization is improved, but carriers may fall and contaminate wafers
Solution Approach 1:
The patent utilizes the vertical dimension by positioning the first holder at an upper level and the second holder at a lower level within the load-lock chamber. This vertical arrangement maximizes space utilization while the upper position of the first holder naturally prevents carriers from the second holder from falling and contaminating wafers, as gravity would cause any falling carriers to land in the lower second holder area rather than on wafers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively inhibits particle adherence to the wafer, enhancing LPD quality by ensuring the before-treatment wafer is isolated from potential dust sources, thereby improving the overall performance of the vapor deposition process.
Implementation Method 1
the wafer transfer chamber communicates, via a gate valve, with the reaction chamber in which a CVD film is formed on the wafer
Implementation Method 2
the reaction chamber in which a CVD film is formed on the wafer
Data Source
AI summary
A vapor deposition device is provided that can ameliorate or improve the LPD quality. A vapor deposition device includes a first holder that supports a carrier at a topmost-level and a second holder that supports the carrier under the first holder in a load-lock chamber, and a second robot mounts a before-treatment wafer extracted from a wafer storage container on the carrier standing by at the first holder in the load-lock chamber.