Load Lock Cooling Gas Inlet Module for Wafer Condensation Prevention
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Solution Overview
Problem
In semiconductor manufacturing, wafers experience condensation issues when transitioning from a high-temperature, high-vacuum load lock chamber to a low-temperature, low-humidity environment due to residual process gases remaining on their surface.
Innovation Solution
A semiconductor device manufacturing system that includes a load lock chamber with a gas pipeline to discharge a cooling gas, such as clean dry air or inert gases, into the chamber to cool and vent the substrate, ensuring no condensation forms on the wafer during transport to the external environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the wafer is transported from the load lock chamber to the external environment, then the wafer can be removed from the vacuum environment, but condensation forms on the wafer surface due to temperature difference
Solution Approach 1:
The system performs preliminary cooling of the wafer in the load lock chamber before transport to the external environment. A cooling plate cools the wafer surface below the dew point temperature, preventing condensation from forming during the subsequent transport to the FOUP or other external storage.
Solution Approach 2:
The load lock chamber serves as an intermediary environment between the vacuum processing chamber and the external atmosphere. It provides a controlled transition zone where the wafer can be cooled and prepared before exposure to the external environment, preventing direct thermal shock and condensation.
2Device complexity
If the load lock chamber is used for both loading and unloading wafers, then the system structure is simplified, but process gases remain on the wafer surface causing contamination
Solution Approach 1:
The load lock chamber maintains a continuous vacuum environment during wafer processing. The chamber remains under vacuum throughout the wafer processing cycle, and the wafer is only exposed to atmosphere when explicitly vented in a controlled manner after processing is complete, preventing unnecessary exposure to contaminants.
Solution Approach 2:
The load lock chamber maintains an inert vacuum environment that prevents process gases from contaminating the wafer surface. By keeping the chamber under vacuum and using controlled venting procedures, the system creates a protective atmosphere that prevents oxidation and contamination of sensitive wafer surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes process gases from the substrate surface, preventing condensation and ensuring the substrate is at room temperature before exposure to the external environment, thus maintaining cleanliness and preventing contamination.
Implementation Method 1
a cooling gas inlet module arranged within the load lock chamber and adjacent to a first side of the internal cavity. The cooling gas inlet module is configured to discharge a gas toward a second side of the internal cavity to cool down the substrate
Implementation Method 2
a pumping port configured to pump air into the load lock chamber
Data Source
AI summary
A semiconductor device manufacturing system is provided. In one embodiment, a load lock chamber of the semiconductor device manufacturing system comprises an internal cavity, a substrate carrier, configured to support and deliver a substrate and a cooling gas inlet module arranged in the internal cavity and adjacent to a first side of the internal cavity. The cooling gas inlet module is configured to discharge a gas toward a second side of the internal cavity to cool down the substrate supported and delivered by the substrate carrier, wherein the second side. The second side is opposite to the first side.