Load Lock Cooling With Non-Contact Temperature Sensing for Substrates
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Solution Overview
Problem
In substrate processing apparatuses, substrates are often unloaded from the load lock chamber to an atmospheric pressure region without being cooled to a desired temperature, leading to potential oxidation and damage to semiconductor devices.
Innovation Solution
A load lock chamber equipped with a substrate support and a non-contact temperature sensor to measure the temperature of the substrate support, allowing for precise temperature control before unloading, using a boat with high thermal conductivity materials and inert gas cooling to ensure substrates are cooled to a safe temperature before transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are unloaded from the load lock chamber without cooling, then the unloading process is faster, but the substrates may oxidize or be damaged due to high temperature exposure to atmospheric pressure
Solution Approach 1:
The substrate is cooled in the load lock chamber before being unloaded to the atmospheric pressure region. This preliminary cooling action prevents oxidation and damage by ensuring the substrate reaches a safe temperature before exposure to atmospheric conditions, thus maintaining substrate integrity while enabling efficient unloading operations.
2Measurement precision
If a contact temperature sensor is used to measure substrate temperature, then measurement accuracy is improved, but the sensor may contaminate or damage the substrate
Solution Approach 1:
A non-contact temperature sensor is used to measure the substrate temperature through the chamber wall or window. This intermediary measurement method allows accurate temperature monitoring without direct contact between the sensor and substrate, thereby avoiding contamination or damage to the substrate while maintaining measurement precision.
3Temperature
If the load lock chamber is equipped with cooling facilities and temperature sensors, then substrate temperature control is improved, but the device complexity increases
Solution Approach 1:
The load lock chamber is equipped with cooling facilities and temperature sensors that serve multiple functions: cooling the substrate before unloading, monitoring temperature during the process, and preventing oxidation. This multi-functional approach improves substrate temperature control while minimizing the increase in device complexity by combining several functions into a single integrated system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurate temperature measurement and control prevent substrate oxidation and damage, ensuring reliable semiconductor device manufacturing by ensuring substrates are cooled to a safe temperature before exposure to atmospheric pressure.
Implementation Method 1
a temperature sensor capable of measuring a temperature of the substrate support in a non-contact manner
Data Source
AI summary
According to one embodiment of the present disclosure, there is provided a technique that includes: a load lock chamber into which a substrate is loaded and from which the substrate is unloaded; a substrate support provided in the load lock chamber and configured to support a plurality of substrates comprising the substrate in a multistage manner with a predetermined interval therebetween; and a temperature sensor capable of measuring a temperature of the substrate support in a non-contact manner while the plurality of substrates are supported by the substrate support.