Load Lock Apparatus Cover Mechanism for FOUP Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing semiconductor wafer processing systems face challenges in efficiently transferring wafers between substrate containers and processing modules due to the need for a wafer transfer mechanism and load lock chambers, which complicates the system configuration and hinders efficient cover opening/closing and delivery hole arrangement, especially when using standard FOUPs without side-opening structures.
Innovation Solution
A load lock apparatus with a load lock chamber connected to a vacuum transfer chamber, featuring a cover attaching/detaching mechanism and an elevating mechanism for FOUPs, allowing for vertical movement and horizontal advancement of the cover, enabling efficient in/out operations without requiring a separate elevating mechanism for the cover attaching/detaching process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a wafer transfer mechanism is installed between the FOUP and the load lock chamber, then wafers can be transferred, but the system configuration becomes enlarged and complex
Solution Approach 1:
The patent combines the FOUP cover opening/closing function and the wafer delivery hole function into a single side surface of the FOUP. This merging eliminates the need for a separate wafer transfer mechanism, as the side surface itself serves as the interface for both cover operation and wafer delivery to the load lock chamber, thereby simplifying the overall system configuration while maintaining operational capability
2Adaptability or versatility
If the FOUP is rotated on a mounting table to change orientation, then cover opening and delivery hole positioning can be achieved, but the system requires additional space and complex arrangement
Solution Approach 1:
Instead of using rotational movement in the horizontal plane to position the delivery hole, the patent positions the delivery hole and cover opening mechanism in the vertical dimension by elevating the FOUP within the load lock chamber. This vertical positioning approach eliminates the need for complex rotational arrangements and mounting tables, achieving the same adaptability with a simpler system configuration
Data Source
AI summary
A load lock apparatus having a load lock chamber, which is connected to a vacuum transfer chamber configured to transfer a substrate under a vacuum pressure state via a communication hole which is opened and closed by a gate valve, and configured to be capable of switching an inner pressure into an atmospheric pressure state and the vacuum pressure state, is provided. The load lock apparatus includes a load lock chamber main body in which a substrate container having an attachable/detachable cover is carried, wherein the communication hole is formed in a side surface of the load lock chamber; and a cover attaching/detaching mechanism installed at a height position vertically arranged with the communication hole in the load lock chamber; and an elevating mechanism including a mounting table on which the substrate container is loaded and configured to lift and lower the mounting table.