Segmented Load Lock Chamber for Halogen Residue Removal
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Solution Overview
Problem
The existing methods for fabricating semiconductor devices face challenges in efficiently removing halogen-containing residues, which lead to particle contamination and corrosion, requiring additional processing steps and increasing manufacturing costs.
Innovation Solution
A load lock chamber with multiple isolated chamber volumes is used, where one volume is dedicated to processing substrates with reactive species to remove halogen-containing residues, and another volume provides cooling to prevent undesirable reactions, allowing for separate paths for incoming and outgoing substrates to reduce cross-contamination and increase throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dedicated remote plasma reactor is used to remove halogen-containing residues, then the residues are converted to non-corrosive volatile compounds, but the tool expense increases and manufacturing productivity decreases
Solution Approach 1:
The patent combines the residue removal function with the existing load lock chamber, eliminating the need for a separate remote plasma reactor. The load lock chamber is configured to perform both substrate transfer and halogen residue removal functions, thereby reducing tool expense and maintaining manufacturing productivity while achieving effective residue conversion to non-corrosive volatile compounds
2Reliability
If a dedicated remote plasma reactor is used to remove halogen-containing residues, then the residues are converted to non-corrosive volatile compounds, but additional processing steps are required
Solution Approach 1:
The patent merges the residue removal process with the substrate transfer process by configuring the load lock chamber to perform both functions. This integration eliminates the need for a separate dedicated reactor and reduces the number of processing steps while maintaining effective halogen residue removal through conversion to non-corrosive volatile compounds
3Productivity
If multiple chamber volumes are used in the load lock chamber, then cross-contamination is reduced and throughput increases, but the chamber complexity increases
Solution Approach 1:
The load lock chamber is segmented into multiple isolated chamber volumes, with a first chamber volume for substrate transfer and a second chamber volume for halogen residue removal. This segmentation prevents cross-contamination between processes and allows simultaneous operation to increase throughput, while the modular design manages the complexity through functional separation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively removes halogen-containing residues, reduces contamination, and enhances manufacturing efficiency by allowing additional processing tools without increasing the system's footprint, while minimizing reactions with the atmosphere.
Implementation Method 1
one chamber volume configured for processing a substrate with reactive species
Implementation Method 2
another chamber volume configured to provide cooling to the substrate
Data Source
AI summary
Examples of the present invention include a method for removing halogen-containing residues from a substrate. The method includes transferring a substrate to a substrate processing system through a first chamber volume of a load lock chamber. The load lock chamber is coupled to a transfer chamber of the substrate processing system. The substrate is etched in one or more processing chambers coupled to the transfer chamber of the substrate processing system with chemistry from a showerhead disposed over a heated substrate support assembly. The chemistry includes halogen. Halogen-containing residues are removed from the etched substrate in a second chamber volume of the load lock chamber. Cooling the etched substrate in a cooled substrate support assembly of the load lock chamber after removing the halogen-containing residue.