Load Lock Nesting in Substrate Transfer Module

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Solution Overview

Problem

Conventional substrate processing apparatuses face an increased installation area due to the expansion of modules, which compromises productivity despite enhanced processing capabilities.

Innovation Solution

The substrate processing apparatus incorporates at least a part of the load lock module within the transfer module, allowing for a reduced footprint by integrating load lock chambers between the transfer and processing modules, thereby maintaining processing capability while minimizing the installation area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of repair

If the process module and load lock module are disposed separately outside the transfer module, then the maintenance accessibility is improved, but the installation area increases

Engineering Contradiction:
Improvemaintenance accessibilityVSAvoidinstallation area
Core Design Contradiction:
Ease of repairVSArea of stationary object

Solution Approach 1:

The load lock module is disposed inside the transfer module, utilizing the internal space of the transfer module to house the load lock chamber. This nesting arrangement reduces the overall installation area while maintaining the functional separation between modules through internal partitioning and accessible maintenance paths.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Area of stationary object

If the load lock module is integrated inside the transfer module, then the installation area is reduced, but the maintenance accessibility deteriorates

Engineering Contradiction:
Improveinstallation areaVSAvoidmaintenance accessibility
Core Design Contradiction:
Area of stationary objectVSEase of repair

Solution Approach 1:

The transfer module is divided into distinct functional regions: a transfer chamber for substrate transfer and a load lock chamber for atmosphere switching. This segmentation allows the load lock module to be integrated inside the transfer module, reducing installation area while maintaining independent access and maintenance capabilities for each functional region through separate access paths.

Inventive Principle:
Principle #1Segmentation

3Productivity

If the transfer path is shortened by integrating modules, then the productivity is improved, but the device complexity increases

Engineering Contradiction:
ImprovethroughputVSAvoidstructural complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The load lock module and transfer module are merged into a single integrated structure where the load lock chamber is positioned inside the transfer module. This merging shortens the transfer path between substrate processing and transfer operations, improving productivity while managing complexity through modular design that allows independent operation of each functional component.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS10679878B2Substrate processing apparatus
Publication Date: 2020.06.09 TOKYO ELECTRON LTD
  • US10679878B2 patent drawing
  • US10679878B2 patent drawing
  • US10679878B2 patent drawing

AI summary

A substrate processing apparatus includes a substrate processing part configured to process a substrate under a vacuum atmosphere, a substrate transfer part connected to the substrate processing part and configured to transfer the substrate under an air atmosphere, and a load lock part disposed between the substrate processing part and the substrate transfer part and configured to switch between the air atmosphere and the vacuum atmosphere. At least a part of the load lock part is disposed inside the substrate transfer part.