Load Lock Camera Inspection for Substrate Handling Accuracy
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Solution Overview
Problem
Current inspection systems for film deposition processes on glass and wafer substrates are inadequate in detecting defects and process parameters, failing to recognize substrate location in the process chamber and accurately evaluating operational parameters.
Innovation Solution
A camera-based inspection system is implemented, with multiple cameras positioned in the load lock unit to capture images of substrates and film-deposited substrates, analyzed by a controller to detect defects such as breakage, cracks, stains, and substrate misplacement, and evaluate transfer robot performance and deposition chamber conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a camera-based inspection system is implemented to detect defects and evaluate process parameters, then measurement precision and reliability are improved, but device complexity increases
Solution Approach 1:
The camera system positioned in the load lock chamber serves multiple functions: capturing substrate images before deposition, monitoring film deposition in real-time, detecting defects, and evaluating process parameters. This multi-functional approach improves measurement precision without proportionally increasing device complexity.
Solution Approach 2:
The camera system acts as an intermediary between the deposition process and quality control, capturing optical images that serve as data for defect detection and process evaluation. This intermediary approach enables non-contact, non-intrusive measurement that maintains process integrity while improving detection accuracy.
2Productivity
If multiple cameras are positioned in the load lock unit to capture real-time images, then productivity and measurement precision are improved, but device complexity and cost increase
Solution Approach 1:
The camera system captures images of substrates before they enter the deposition chamber and during the deposition process. This preliminary and continuous imaging enables real-time quality assessment without interrupting the production flow, thereby improving productivity while managing system complexity through strategic positioning.
Solution Approach 2:
The inspection system operates continuously throughout the deposition process, capturing images at multiple stages (before deposition, during deposition, and after deposition). This continuous monitoring ensures no defects are missed and maintains high productivity without requiring separate inspection cycles that would increase overall system complexity.
3Measurement precision
If image analysis is performed to detect substrate location and defects, then measurement precision is improved, but loss of time in processing increases
Solution Approach 1:
The system performs real-time image analysis and provides immediate feedback on substrate location, orientation, and defect detection. This feedback mechanism enables rapid correction of positioning errors and immediate identification of defects without significant time loss, as the analysis is integrated into the continuous deposition process.
Solution Approach 2:
The system replaces manual inspection methods with automated optical image analysis. The controller automatically processes images to detect substrate location and defects, eliminating time-consuming manual examination while maintaining high measurement precision through algorithmic image processing.
Data Source
AI summary
A method of inspection and an inspection system for the film deposition process for substrates that includes glass and wafer are disclosed. The inspection system includes multiple camera modules positioned in a load lock unit of a process chamber, such as the camera modules that can capture images of the substrate in the load lock. The images are analyzed by a controller of the inspection system to determine the accuracy of robots in handling the substrate, calibration of the robots based on the analysis, and defects in the substrate caused during the handling and deposition process.