Load Lock Fast Pump Vent Actuator Relocation
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Solution Overview
Problem
In semiconductor processing, conventional loadlock systems face challenges with high equipment complexity and cost due to multiple loadlock modules, leading to increased downtime for repairs and substrate contamination risks from door actuators located above the substrate transfer plane.
Innovation Solution
A semiconductor processing tool design featuring a frame with a chamber and a door system where the drive actuators are positioned outside the substrate transfer zone, allowing for efficient sealing and minimizing contamination risks by relocating the door actuators below the substrate transfer plane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple loadlock modules are used to increase throughput, then productivity is improved, but device complexity increases
Solution Approach 1:
The loadlock chamber is divided into a first chamber portion and a second chamber portion separated by a partition wall, allowing independent pumping of each portion. This segmentation enables parallel processing operations while maintaining a single integrated loadlock structure, thereby increasing throughput without proportionally increasing overall device complexity
Solution Approach 2:
The single loadlock chamber is designed to perform multiple functions: it can simultaneously support different processing operations in different chamber portions, accommodate various substrate sizes, and provide both atmospheric and vacuum environments through the partition wall design, replacing the need for multiple specialized loadlock modules
2Reliability
If door actuators are located above the substrate transfer plane to enable sealing, then sealing function is achieved, but substrate contamination risk increases
Solution Approach 1:
The door actuators are extracted from the substrate transfer zone and repositioned in the vacuum chamber portion above the partition wall. This separation removes the source of potential contamination (actuators with moving parts) from the atmospheric substrate transfer area while preserving the sealing function through the door's interaction with the loadlock chamber
Solution Approach 2:
The partition wall serves as an intermediary structure that separates the vacuum chamber from the atmospheric chamber. It provides a mounting surface for the door actuators in the vacuum environment while preventing them from contaminating substrates in the atmospheric transfer zone, thus mediating between sealing requirements and contamination prevention
3Reliability
If the loadlock seal contact surface is damaged and requires repair, then sealing reliability is restored, but loss of time increases
Solution Approach 1:
The loadlock chamber is segmented into pumpable and non-pumpable portions separated by a partition wall. This segmentation allows the sealing contact surface to be located in the non-pumpable atmospheric portion, enabling quick access and replacement without requiring pump-down procedures, thereby reducing repair downtime while maintaining sealing reliability
Solution Approach 2:
The design facilitates quick replacement of the door or seal components in the atmospheric chamber portion. Rather than performing extensive repairs on expensive vacuum components, the system allows for rapid exchange of simpler sealing elements that can be accessed without breaking vacuum, effectively treating seal components as replaceable parts that minimize downtime
Data Source
AI summary
A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.