Load Port Leveling Sensor with Accelerometer Vibration Detection
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Solution Overview
Problem
Semiconductor wafers are prone to defects due to misalignment and excessive vibration of load ports during transfer, leading to contamination and damage, which reduces device yield.
Innovation Solution
Incorporating accelerometers into load port sensors to detect leveling and vibration, providing visual and audio warnings to correct misalignment and excessive vibration, and using a load port computer to automatically level the load port.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If load port is used to transfer wafers automatically, then productivity is improved, but misalignment and excessive vibration occur causing defects
Solution Approach 1:
The patent employs accelerometers and level sensors to continuously monitor vibration and alignment of the load port during wafer transfer operations. The sensor data is fed back to a control system that can detect misalignment and excessive vibration conditions, enabling real-time monitoring and correction to prevent wafer defects while maintaining automated transfer efficiency
Solution Approach 2:
The patent replaces manual mechanical alignment methods with automated sensor-based detection systems. Accelerometers and level sensors substitute for traditional mechanical alignment procedures, providing precise digital measurement and control of load port positioning and vibration levels during automated wafer transfer
2Manufacturing precision
If manual alignment method is used, then manufacturing precision is maintained, but time consumption increases
Solution Approach 1:
The patent implements self-leveling functionality where the load port system automatically monitors and corrects its own alignment using integrated accelerometers and level sensors. The system performs self-diagnosis and self-adjustment without requiring external manual intervention, maintaining high alignment precision while significantly reducing the time needed for leveling operations
3Device complexity
If vibration is not controlled, then device complexity is reduced, but defects increase due to misalignment
Solution Approach 1:
The patent incorporates vibration sensors (accelerometers) that continuously monitor load port vibration during operation. The sensor output is fed back to a control system that can detect excessive vibration conditions and trigger corrective actions, providing real-time feedback control to maintain transfer accuracy without requiring overly complex mechanical damping structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents defects in semiconductor wafers by ensuring proper alignment and minimizing vibration, thereby increasing device yield and preventing contamination.
Implementation Method 1
a sensor including an accelerometer configured to detect an acceleration of the sensor
Data Source
AI summary
A leveling sensor, a load port including a leveling sensor, and a method of leveling a load port using a load port are disclosed. In an embodiment, a sensor includes an accelerometer configured to detect leveling and vibration of a load port and produce a plurality of data; a plurality of indicator lights configured to display a level measurement and a level direction based on the leveling of the load port; a processor configured to process the data produced by the accelerometer; and a wired connection configured to connect the processor to an external device.