Load Port Shutter for Purge Gas Atmosphere Control
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Solution Overview
Problem
The existing methods for loading and unloading thin-plate-shaped substrates into hermetically-sealed containers fail to prevent oxidation of the substrate surfaces due to exposure to oxygen or moisture, leading to undesirable natural oxidation films and contamination, which affect the desired characteristics of semiconductor elements.
Innovation Solution
A load port with a shutter portion that can shield the opening portion of the substrate storage container, allowing for the introduction of a purge gas to replace the atmosphere inside the container quickly, reducing exposure to external air and minimizing oxidation risks during loading and unloading processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the lid of the substrate storage container is opened for loading and unloading substrates, then the substrate can be transferred in and out, but oxygen or moisture from the external air enters the container and causes oxidation of the substrate surface
Solution Approach 1:
A purge gas is supplied into the substrate storage container before the lid is opened to replace the internal atmosphere with an inert gas atmosphere. This preliminary action ensures that when the lid is subsequently opened for substrate loading and unloading, the substrate surfaces are already protected from oxidation by the inert gas environment, eliminating the need for post-opening atmosphere control.
Solution Approach 2:
The patent introduces a purge gas (inert gas) into the substrate storage container to create an inert atmosphere that prevents oxidation of substrate surfaces. By replacing the air-filled environment with an inert gas environment, the harmful oxidation reaction is eliminated while allowing the lid to remain open for substrate transfer operations.
2Object-affected harmful factors
If a purge gas is supplied into the substrate storage container to replace the atmosphere, then oxidation of substrate surfaces is prevented, but the complexity of the system increases due to additional gas supply mechanisms
Solution Approach 1:
The lid of the substrate storage container serves multiple functions: it acts as both a mechanical cover for substrate storage and as a seal for atmosphere control. By integrating the sealing function into the existing lid structure, the patent avoids adding separate complex sealing mechanisms while still enabling effective atmosphere replacement with purge gas.
3Productivity
If the opening portion remains open during substrate transfer, then loading and unloading operations are efficient, but the exposure time to external air increases oxidation risk
Solution Approach 1:
The purge gas supply is activated before the lid is opened, so that the inert atmosphere is already established in the container before substrate transfer begins. This allows the opening to remain open for the entire duration of the transfer operation without increasing oxidation risk, as the protective atmosphere is in place throughout the process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents oxidation of substrate surfaces by maintaining a high concentration of purge gas within the container, ensuring the substrate remains in a clean atmosphere, thereby preserving the desired characteristics of semiconductor elements.
Implementation Method 1
A load port with a shutter portion that can shield the opening portion of the substrate storage container, allowing for the introduction of a purge gas to replace the atmosphere inside the container
Data Source
AI summary
Provided is a load port capable of loading and unloading a substrate by a transfer robot in a state where a purge gas atmosphere is maintained inside a substrate storage space. After the lid of the substrate storage container is opened, an opening portion of the substrate storage container is closed by a frame sealing a peripheral edge of the opening portion of the substrate storage container and a shutter portion where a plurality of shielding plates are disposed in a vertical direction at a third position which is further moved forward from a release position. The shutter portion can locally move all or a portion of the shielding plates to form a narrow opening portion (third opening portion), and transferring of the substrate in the state where an atmosphere of the substrate storage space is replaced is performed through the narrow opening portion (third opening portion).