Load Sensor with Vertical Transistors for Direction Detection

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Solution Overview

Problem

Existing load sensors face challenges in miniaturization and high-density formation while detecting both the magnitude and direction of loads, particularly in distinguishing between vertical and horizontal loads applied to complex-shaped objects, due to limitations in adhesive material usage and separation of load detection mechanisms.

Innovation Solution

A load sensor design incorporating vertical transistors with a substrate and rib structure, featuring a gate electrode, gate insulation film, and semiconductor thin film on the rib's side surface, allowing for the detection of load magnitude and direction through controlled channel region formation and electric current changes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If adhesive material is used to attach a thin film sensor to the convex portion of an elastic body, then the sensor can be formed on the side surface, but miniaturization and high-density formation become difficult

Engineering Contradiction:
Improvesensor formation processVSAvoidminiaturization and high-density formation
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The sensor is divided into multiple independent vertical transistors, each capable of detecting loads in different directions. This segmentation allows for high-density integration of multiple sensors on the same elastic body surface, overcoming the limitation of adhesive-based thin film sensors that难以 achieve high-density formation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from planar thin film sensors to three-dimensional vertical transistor structures. The vertical channel configuration allows current flow in the vertical direction while detecting horizontal loads, utilizing the third dimension to resolve the contradiction between ease of manufacture and manufacturing precision for miniaturization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If a single sensor configuration is used on the elastic body, then the structure is simple, but the ability to detect both magnitude and direction of loads is limited

Engineering Contradiction:
Improvesensor structureVSAvoidload direction detection
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

Each vertical transistor is designed to detect loads in multiple directions through its geometric configuration. The channel direction of each transistor can detect loads perpendicular to its channel, allowing a single sensor structure to serve multiple detection functions, thus improving measurement precision without proportionally increasing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The vertical transistors are arranged with asymmetric orientations relative to the convex portion of the elastic body. By positioning transistors at different angles (e.g., 45 degrees relative to each other), the system can detect load directions in two-dimensional space, enabling precise direction detection while maintaining relatively simple device structure.

Inventive Principle:
Principle #4Asymmetry

3Ease of manufacture

If vertical transistors are formed on the side surface of a rib with trapezoidal shape, then thin-film technology can be used, but separation between vertical load detection and horizontal load detection remains difficult

Engineering Contradiction:
Improvethin-film technology applicationVSAvoidload direction separation
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

Different regions of the elastic body are equipped with vertical transistors having different channel orientations. Each local region's transistor configuration is optimized for detecting specific load directions, allowing the system to distinguish between vertical and horizontal loads through spatial differentiation of sensor responses.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate detection of both load magnitude and direction without the limitations of miniaturization and high-density formation, improving tactile sensing capabilities for complex-shaped objects by differentiating between vertical and horizontal loads.

Implementation Method 1

Each of the at least two vertical transistors includes: a gate electrode, a gate insulation film, and a semiconductor thin film which are arranged on the side surface of the rib; a bottom electrode layer arranged on a bottom of a concave portion of the substrate so as to contact the semiconductor thin film

Methodology Applied
Scientific EffectField effect transistor operation: Conduction (electrical)

Implementation Method 2

When loaded, the sensor can detect the magnitude and the direction of a load by detecting distortion applied to a convex portion of the elastic body

Methodology Applied
Scientific EffectMechanical deformation: Deformation

Data Source

PatentUS10180364B2Load sensor with vertical transistors
Publication Date: 2019.01.15 DENSO CORP
  • US10180364B2 patent drawing
  • US10180364B2 patent drawing
  • US10180364B2 patent drawing

AI summary

A load sensor includes: a substrate; a rib on the substrate; and two vertical transistors. Each vertical transistor includes: a gate electrode, a gate insulation film, and a semiconductor thin film on the side surface of the rib; a bottom electrode layer on a bottom of the substrate, on which the rib is not arranged, with contacting the semiconductor thin film; and a top electrode layer on a top of the rib with contacting the semiconductor thin film. Each vertical transistor flows current between the bottom electrode layer and the top electrode layer when a channel region is provided in the semiconductor thin film. Each straight line along normal line directions of the channel regions in the vertical transistors is arranged on a different side surface of the rib from each other, and has a predetermined angle between the straight lines.