Folded-Metal Loading Frame for High I/O CPU Package Mounting
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Solution Overview
Problem
The challenge of integrating high-performance system on chip semiconductor packages into electronic systems is exacerbated by component integration difficulties, particularly in packaging and integration, where varying CPU package heights and increased electrical interface pin counts require a loading frame design that supports different CPUs and distributes loading forces evenly to prevent component damage and warping.
Innovation Solution
A loading frame design with studs positioned along the legs, C-shaped cross-sectioned legs, and lateral torsion springs, optionally with shims, to evenly distribute loading forces and prevent bending, accommodating varying CPU thicknesses and pin counts, while using a lightweight yet structurally firm assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a loading frame is designed to support high I/O count CPUs with varying package heights, then adaptability to different CPU types is improved, but structural complexity increases due to the need for adjustable mechanisms
Solution Approach 1:
The loading frame utilizes laterally movable studs that can be repositioned along the legs to different heights, changing the geometric parameters of the frame to accommodate varying CPU package heights. This allows a single frame design to adapt to multiple CPU types without requiring complex adjustable mechanisms.
Solution Approach 2:
The loading frame is divided into modular components including separate legs with multiple studs at different heights. This segmentation allows individual studs to be selectively positioned and removed based on the specific CPU package height requirements, simplifying the overall structure while maintaining adaptability.
2Quantity of substance
If electrical interface pin count is increased for higher I/O capacity, then functionality is improved, but susceptibility to loading-induced damage increases
Solution Approach 1:
The loading frame applies controlled loading forces through the studs to the CPU package and heat sink assembly before final installation. This preliminary action ensures that the electrical interface contacts are properly seated and the structure is pre-stressed to resist subsequent thermal and mechanical loads, preventing damage to the high-pin-count interface.
Solution Approach 2:
The loading frame design incorporates compliant elements and distributed loading paths that cushion and distribute mechanical stresses away from the fragile electrical interface pins. This protective mechanism is built into the frame structure to prevent loading-induced damage during installation and operation.
3Ease of operation
If loading forces are concentrated on few contact points, then ease of mounting is improved, but risk of component warping and damage increases
Solution Approach 1:
The loading force is segmented and distributed through multiple studs positioned at different locations on the loading frame legs. Each stud contacts the CPU package or heat sink at a separate point, spreading the total loading force across many contact points rather than concentrating it, thereby preventing warping while maintaining ease of mounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stable electrical connections and prevents component damage by evenly distributing loading forces, allowing for high I/O count CPUs to be mounted with thinner backplates, suitable for high-density semiconductor chip packaging in compact form factors.
Implementation Method 1
laterally movable studs (507) positioned along the legs (515), the studs (507) being coupled to the legs (515) with lateral torsion springs
Data Source
AI summary
An apparatus is described. The apparatus includes a loading frame for mounting a packaged semiconductor chip and a heat sink for the packaged semiconductor chip to a socket. The loading frame is comprised of metal. The loading frame has at least one frame leg where the metal is folded to re-enforce a strength of the frame leg.