Loadlock Cooling Chamber Gas Flow for Uniform Substrate Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor manufacturing processes face challenges in quickly and uniformly cooling substrates, which can lead to thermal stress and particle generation, particularly due to the limitations of conventional cooling methods like convection that reduce treatment rates and increase particle formation.
Innovation Solution
A substrate treating apparatus with a cooling unit in the loadlock chamber, featuring a cooling chamber with a gas inflow hole, support pins, a gas injection block, and a gas exhaust part, which supplies and exhausts a cooling gas to efficiently cool the substrate while minimizing particle introduction through controlled gas flow and air curtains.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conduction cooling method is used, then cooling efficiency is improved, but thermal stress on substrate increases and particles are generated
Solution Approach 1:
The patent applies pneumatic cooling by introducing a cooling gas (such as nitrogen or air) into the loadlock chamber to cool the substrate. The gas flow is controlled through regulated inflow and outflow, creating a convection current that removes heat from the substrate surface without direct contact, thereby avoiding thermal stress and particle generation while maintaining high cooling efficiency
Solution Approach 2:
The patent uses an inert or controlled atmosphere (typically nitrogen or filtered air) in the loadlock chamber during the cooling process. This controlled environment prevents contamination and reduces thermal stress by providing uniform cooling conditions, eliminating the harmful effects associated with conventional conduction methods
2Object-affected harmful factors
If convection cooling method is used, then thermal stress and particles are reduced, but cooling rate decreases
Solution Approach 1:
The patent employs dynamic gas flow control by regulating the inflow and outflow rates of cooling gas in real-time. The gas flow velocity and pressure are adjusted to optimize heat transfer efficiency while maintaining uniform cooling across the substrate surface, achieving both high cooling rate and minimal thermal stress through dynamically optimized convection conditions
Solution Approach 2:
The patent changes key parameters of the cooling process including gas flow rate, pressure, temperature, and composition to optimize cooling performance. By dynamically adjusting these parameters, the system achieves rapid cooling rates while maintaining uniform temperature distribution that minimizes thermal stress and particle generation
3Productivity
If rapid cooling is implemented, then treatment rate is improved, but thermal stress on substrate increases
Solution Approach 1:
The patent applies local quality control by creating zones of different gas flow rates and cooling intensities across the substrate surface. The cooling gas is distributed uniformly to ensure all areas cool at appropriate rates, preventing localized thermal stress while maintaining overall rapid cooling and high treatment throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enables rapid and uniform cooling of substrates, reducing thermal stress and particle generation, thereby enhancing the substrate treatment process by maintaining high treatment rates and minimizing particle contamination.
Implementation Method 1
The cooling process may be performed by using conduction and convection. The convection method may be mainly performed under the atmospheric state to reduce occurrences of the thermal stress and particles.
Implementation Method 2
air curtain holes may be defined along an edge area of the gas injection block
Implementation Method 3
The convection method may be mainly performed under the atmospheric state to reduce occurrences of the thermal stress and particles.
Data Source
AI summary
Provided is a substrate treating apparatus. The substrate treating apparatus includes an equipment front end module, a loadlock chamber, a transfer chamber, and a plurality of process chambers. The loadlock chamber includes a cooling unit for cooling a substrate treated in the process chambers, and the cooling unit includes a cooling chamber having an inner space, the cooling chamber having a gas inflow hole in one surface thereof, wherein support pins on which the substrate is placed are disposed around a circumference of the gas injection hole, a cooling gas injection part supplying a cooling gas toward the gas inflow hole, and a gas exhaust part exhausting the cooling gas supplied into the cooling chamber and fumes generated from the substrate to the outside of the cooling chamber.