Local Conductive Shielding for Electronic Die Interconnects
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Solution Overview
Problem
Existing electronic devices with high-frequency signal transmission are prone to signal attenuation and electromagnetic interference due to surrounding electromagnetic fields, and traditional metal shielding solutions are costly and insufficiently effective when installed globally rather than locally.
Innovation Solution
A method involving the installation of complementary electrical connection wires between chip and support plate pads, followed by local dielectric and conductive shielding using epoxy resin with metallic particles, which are in contact with the wires and pads to provide targeted electromagnetic protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If global metal shielding plates are installed to reduce electromagnetic interference, then electromagnetic protection is provided, but device complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent applies local quality by placing conductive shielding material specifically at critical locations near electrical connection wires and pads, rather than using global shielding. The conductive putty is applied locally to create shielding zones where electromagnetic interference is most problematic, reducing overall device complexity while maintaining protection effectiveness.
Solution Approach 2:
The shielding solution is segmented into discrete applications of conductive putty at specific locations around electrical connection wires and pads. Rather than a continuous global shielding structure, the protection is divided into multiple localized shielding zones, each addressing specific interference sources independently.
2Object-affected harmful factors
If global metal shielding plates are installed to reduce electromagnetic interference, then electromagnetic protection is provided, but manufacturing cost increases
Solution Approach 1:
By applying conductive putty locally at critical interference zones rather than implementing global metal shielding, the patent reduces material costs and manufacturing complexity. The localized approach uses smaller quantities of conductive material only where electromagnetic protection is most needed, significantly lowering overall manufacturing costs.
Solution Approach 2:
The patent uses conductive putty, a relatively inexpensive material, as a temporary or permanent shielding solution during assembly and operation. This replaceable, low-cost material substitutes for expensive metal shielding plates, reducing manufacturing costs while providing adequate electromagnetic protection.
3Object-affected harmful factors
If metal shielding plates are installed to reduce electromagnetic interference, then shielding is provided, but the shielding is global and distant from electrical connection wires, resulting in insufficient protection
Solution Approach 1:
The conductive putty is applied in immediate proximity to electrical connection wires and pads, creating localized shielding zones that directly surround the most vulnerable components. This close proximity ensures strong electromagnetic field containment, significantly improving protection effectiveness compared to distant global shielding.
Solution Approach 2:
The conductive putty acts as an intermediary shielding material that can conform to and surround electrical connection wires and pads. This flexible intermediary material fills spaces and creates intimate contact with protected components, providing superior electromagnetic shielding compared to rigid metal plates that cannot closely follow component geometries.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces electromagnetic interference by creating a localized conductive shield close to the electrical connection wires, enhancing signal integrity and reducing production complexity and costs compared to global metal shielding solutions.
Implementation Method 1
a conductive material which is in contact with the electrical connection wire and/or with the electrical connection pad, in order to ensure local electromagnetic shielding
Implementation Method 2
a dielectric material coating which isolates the electrical connection wire from its environment
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A method for making an electrical connection between an electronic chip (3) and a support plate (2) of this chip and electronic device, wherein: an electrical connecting wire (113) connects an exposed electrical connection pad of the electronic chip and an exposed electrical connection pad of the support plate and electrical junctions are provided between the ends of the electrical connecting wire and the pads, the electrical connecting wire being provided with an insulating sheath (113a); a local dielectric coating (117a, 117b) covers at least partially at least one of the pads and the adjacent junction and surrounds at least partially an adjacent end portion of the insulating sheath, and a local conductive shield (119) covers at least partially said dielectric coating and surrounds at least partially the insulating sheath.