Local Conductive Shielding for High-Frequency Signal Integrity
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Solution Overview
Problem
Existing electronic devices with high-frequency signal transmission suffer from signal attenuation and electromagnetic interference due to surrounding electromagnetic fields, and conventional metal shielding solutions are costly, difficult to install, and provide insufficient protection.
Innovation Solution
A method involving the use of local conductive shielding, where a conductive material is applied directly to electrical connection wires and pads, forming a dielectric layer and then a conductive shield close to the wires to mitigate electromagnetic interference, using spraying or immersion techniques with materials like epoxy resin or parylene for dielectric coating and conductive materials with metallic particles for shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If metal shielding plates are added to protect high-frequency signals from electromagnetic interference, then electromagnetic protection is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent applies conductive shielding material locally only around the electrical connection wires that carry high-frequency signals, rather than using global metal shielding plates. This localized approach provides electromagnetic protection precisely where needed while avoiding the complexity and cost of comprehensive shielding structures.
Solution Approach 2:
The conductive shielding material is integrated within the encapsulation structure itself, forming a nested configuration where the shielding layer is embedded inside the encapsulant material. This eliminates the need for separate external shielding plates and reduces overall device complexity.
2Object-affected harmful factors
If metal shielding plates are installed and connected to ground, then electromagnetic protection is improved, but manufacturing cost and installation difficulty increase
Solution Approach 1:
The patent combines the shielding function with the encapsulation process by integrating conductive shielding material into the encapsulant material itself. This merging of functions eliminates the need for separate shielding plate installation and grounding operations, significantly simplifying manufacturing.
Solution Approach 2:
The encapsulation process automatically provides shielding functionality through the integrated conductive material, eliminating the need for separate shielding installation steps. The structure serves its own shielding needs through the inherent properties of the encapsulant material.
3Area of stationary object
If global metal shielding plates are used, then electromagnetic protection coverage is improved, but shielding effectiveness decreases due to distance from wires
Solution Approach 1:
The patent concentrates shielding material directly around the electrical connection wires in the immediate vicinity of the chip, providing intensive local protection where electromagnetic interference is most severe, rather than distributing shielding coverage broadly at a distance.
Solution Approach 2:
The shielding approach transitions from two-dimensional planar shielding plates to three-dimensional volumetric shielding by embedding conductive material within the encapsulant that surrounds the wires in multiple dimensions, providing more comprehensive coverage closer to the signal paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides effective electromagnetic protection for high-frequency signals by creating a localized conductive shield connected to ground, reducing interference and production costs while improving shielding efficiency.
Implementation Method 1
The distribution of the dielectric material can be carried out by spraying
Implementation Method 2
a conductive material is applied directly to electrical connection wires and pads, forming a dielectric layer and then a conductive shield close to the wires to mitigate electromagnetic interference
Data Source
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AI summary
A method for making an electrical connection between an electronic chip (3) and a support plate (2) of this chip and electronic device, wherein: an electrical connecting wire (213) connects an exposed electrical connection pad of the chip and an exposed electrical connection pad of the support plate and makes electrical junctions between the ends of the wire and the pads, a dielectric layer of a dielectric material over an area of the electronic chip and the support plate, including the electrical connecting wire, the junctions and the pads, such that this dielectric layer makes a local dielectric coating (217b) which at least partially surrounds the electrical connecting wire and at least partially covers the junctions and the pads, and a local conductive shield (219) of an electrically conductive material at least partially covers the local dielectric coating.