Wiring Circuit Board With Local Heat-Dissipating Insulation
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Solution Overview
Problem
Conventional wiring circuit boards experience damage to the base insulating layer due to heat transmission from solder, which can lead to the insulating layer being easily released from the metal support layer.
Innovation Solution
Incorporating a thinner heat dissipating portion between the terminal and the metal layer, which efficiently dissipates heat away from the insulating layer, thereby reducing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a base insulating layer is disposed between the metal support layer and the pad portion, then electrical insulation is provided, but the insulating layer may be damaged by heat transmitted from molten solder
Solution Approach 1:
The insulating layer is designed with different thicknesses in different regions: a first insulating layer with greater thickness in areas away from terminals, and a second insulating layer with smaller thickness directly beneath terminals. This local variation allows the insulating layer to provide adequate electrical insulation while reducing heat damage from soldering operations at critical locations.
Solution Approach 2:
The thickness parameter of the insulating layer is changed based on location. By reducing the thickness of the second insulating layer beneath terminals compared to the first insulating layer in other areas, the design optimizes both electrical insulation performance and thermal resistance during soldering, preventing damage while maintaining functionality.
2Object-affected harmful factors
If the insulating layer is made thinner to reduce heat damage, then heat damage is reduced, but the insulating layer may be easily released from the metal support layer
Solution Approach 1:
The insulating layer employs non-uniform thickness distribution, being thinner only where heat damage occurs (beneath terminals) while maintaining adequate thickness elsewhere. This localized thinning reduces heat damage risk without compromising overall adhesion strength, as the majority of the insulating layer retains sufficient thickness for strong bonding to the metal support layer.
Solution Approach 2:
The insulating layer is segmented into two distinct regions with different thickness characteristics: the first insulating layer with greater thickness providing adhesion and insulation, and the second insulating layer with smaller thickness providing heat damage protection. This segmentation allows each region to optimize its function independently.
3Adaptability or versatility
If multiple terminals are present, then circuit functionality is improved, but heat concentration in the insulating layer increases
Solution Approach 1:
The insulating layer design applies local quality variation where the second insulating layer with smaller thickness is positioned specifically beneath each terminal to handle heat concentration, while the first insulating layer maintains greater thickness in inter-terminal regions. This allows multiple terminals to function simultaneously without excessive heat accumulation in the insulating layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat dissipating portion effectively suppresses damage to the insulating layer by efficiently dissipating heat, even when multiple terminals are involved, ensuring the insulating layer's integrity.
Implementation Method 1
the heat transmitted to the heat dissipating portion through the terminal can smoothly be dissipated into the metal layer
Data Source
AI summary
A wiring circuit board includes a metal layer, a first insulating layer, and a circuit pattern. The circuit pattern includes a terminal and a wire connected to the terminal. The first insulating layer includes a main body portion disposed between the wire and the metal layer, and a heat dissipating portion in contact with the terminal and in contact with the metal layer. The thickness (second thickness) of the heat dissipating portion is smaller than the thickness (first thickness) of the main body portion.