Localized Cooler Flow Paths for Electronic Component Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic component cooling systems suffer from inefficiencies and complex manufacturing processes, leading to suboptimal heat management and increased system thickness.
Innovation Solution
A system with at least two electronic components, each having a cooler with a localized flow path over its outer surfaces, reducing cooling capacity waste and simplifying design and manufacturing through the use of a plastic casing and Direct Bonded Copper layers for enhanced heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a common cooling channel is used for multiple electronic components, then the cooling system structure is simplified, but the cooling efficiency decreases due to heat transfer between adjacent components through the cooling channel
Solution Approach 1:
The cooling channel is divided into separate segments for each electronic component. Each cooling channel is associated with only one electronic component, preventing heat transfer between adjacent components through the cooling channel while maintaining manageable system complexity through modular design.
Solution Approach 2:
Each electronic component is provided with its own dedicated cooling channel with optimized geometry and flow characteristics tailored to the specific thermal requirements of that component. This allows localized optimization of cooling efficiency for each component without compromising the overall system.
2Reliability
If the cooling channel flow path extends over the entire component width, then all areas are cooled, but cooling capacity is wasted on areas that do not require cooling
Solution Approach 1:
The cooling channel flow path is designed to extend only over those portions of the electronic component that generate heat and require cooling. By matching the cooling channel geometry to the actual heat-generating areas, the system achieves effective cooling coverage while eliminating waste of cooling capacity on non-heat-generating areas.
3Reliability
If multiple cooling channels are used for each electronic component, then cooling efficiency is improved, but the manufacturing complexity and system thickness increase
Solution Approach 1:
The system uses multiple cooling channels, with each cooling channel dedicated to cooling a specific electronic component. This segmentation approach improves cooling efficiency by providing targeted cooling to each component while maintaining manufacturing feasibility through modular, standardized cooling channel designs that can be produced using conventional techniques.
4Device complexity
If electronic components are cooled from the side facing the cooling channel, then the cooling system is simpler, but the cooling effectiveness is reduced due to heat generation on the opposite side
Solution Approach 1:
Instead of cooling the electronic components from the side facing the cooling channel, the system is designed to cool the components from the opposite side. The cooling channel is positioned to cool the side of each electronic component that faces away from the cooling channel flow path, effectively removing heat from the heat-generating surfaces where conventional approaches would fail.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances cooling efficiency while reducing thermal resistance and system thickness, resulting in improved heat transfer and simplified assembly.
Implementation Method 1
a cooler arrangement, for the respective component package (2), having at least one associated cooler (11) wherein a flow path (12) of a cooling fluid leads through each cooler (11)
Implementation Method 2
Direct Bonded Copper layers for enhanced heat transfer
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The present invention relates to a system (1) which has at least one component package (2) each with at least one electronic component (3), in particular a semiconductor component (4). The respective component (3) has a first outer surface (6) and a second outer surface (7) facing away from the first outer surface (6). Improved cooling efficiency and simplified manufacture are achieved by providing for at least one of the outer surfaces (6, 7) of the components (3) a cooler (11), wherein a flow path (12) in the cooler (11) substantially locally extends over the associated outer surface (6, 7). The invention further relates to an electric application (100) comprising such a system (1).