Localized Electrodeposition Using a Patterned Anode Without Masking

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Solution Overview

Problem

Traditional electrochemical deposition methods for solar cells require masking processes like photolithography, which increase costs and make some solar cell types unviable for production due to the need for additional processing steps and expensive masking materials.

Innovation Solution

Localized electrochemical deposition (LECD) system where a cathode is placed near a patterned anode in a metal electrolyte bath, allowing for patterned metal deposition without pre-deposition patterning steps, using one or more fixed anodes to create a localized electric field for metal deposition, eliminating the need for masking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional electroplating with mask layer is used, then metal deposition can be patterned, but production cost increases and process complexity increases

Engineering Contradiction:
Improvepatterned metal depositionVSAvoidmasking process
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent removes the masking layer from the cathode surface entirely, extracting the problematic intermediate step. Instead of depositing metal through a mask, the system uses a patterned anode to directly create the desired metal pattern on the cathode through localized electrochemical deposition, eliminating the need for mask application, alignment, and removal steps

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent inverts the traditional approach by placing the pattern on the anode instead of the cathode. Rather than using a patterned mask on the cathode to block metal deposition, the system uses a patterned anode to locally generate metal ions that deposit only in the desired areas, reversing which electrode carries the pattern

Inventive Principle:
Principle #13The other way round (Inversion)

2Manufacturing precision

If photolithography masking is used, then metal deposition region can be defined, but production cost increases substantially

Engineering Contradiction:
Improvedeposition region definitionVSAvoidproduction cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent employs a disposable or easily replaceable patterned anode that can be fabricated using simple, low-cost techniques. The anode pattern transfers the desired metal deposition pattern directly during electroplating, eliminating the need for expensive photolithography materials and processes while maintaining precise deposition control

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent replaces the complex mechanical and chemical photolithography system with a simpler electrochemical system. Instead of using photoresist coatings, UV exposure, and chemical etching to define patterns, the system uses electrical current to directly deposit metal in the desired pattern through the patterned anode, substituting a straightforward electrochemical process for a multi-step mechanical-chemical process

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If silver paste with additives is used, then screen printing can be performed, but metal conductivity decreases and resistivity increases

Engineering Contradiction:
Improvescreen printing capabilityVSAvoidelectrical conductivity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent produces homogeneous, pure metal deposits through electrochemical deposition from a patterned anode, eliminating the need for composite silver paste formulations. The electroplating process deposits pure metal with uniform composition and structure, achieving consistent electrical properties without the resistivity-increasing additives required for screen-printable paste

Inventive Principle:
Principle #33Homogeneity

Solution Approach 2:

The patent changes the deposition method from screen printing to electrochemical deposition, fundamentally altering the material parameters. Instead of depositing paste containing organic binders and conductive additives, the system electroplates pure metal directly onto the cathode, achieving superior electrical conductivity by changing the deposition process parameters rather than adjusting paste composition

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

LECD reduces production costs and increases efficiency by enabling patterned metal deposition directly on solar cells without the need for photolithography or other masking processes, maintaining the desirable properties of pure metal and reducing resistivity.

Implementation Method 1

An electric field created by the formation anode determines the locations of metal deposition, providing a localized deposition without need for photolithography or other masking of the material to be plated

Methodology Applied
Scientific EffectElectric field: Electric Field

Implementation Method 2

Localized electrochemical deposition (LECD) is provided. The aim of LECD is to create a patterned electrodeposited metal layer on a cathode without the use of pre-deposition patterning steps

Methodology Applied
Scientific EffectElectrochemical deposition: Electrodeposition

Data Source

PatentUS12139810B2Localized electrochemical deposition
Publication Date: 2024.11.12 THE ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIV OF ARIZONA
  • US12139810B2 patent drawing
  • US12139810B2 patent drawing
  • US12139810B2 patent drawing

AI summary

Localized electrochemical deposition (LECD) is provided. The aim of LECD is to create a patterned electrodeposited metal layer on a cathode without the use of pre-deposition patterning steps. In embodiments described herein, an LECD device includes a cathode (a material to be plated) placed sufficiently close to a formation anode in a metal electrolyte chemical bath. The LECD device is then activated electrically in solution. An electric field created by the formation anode determines the locations of metal deposition, providing a localized deposition without need for photolithography or other masking of the material to be plated.