Localized Electroforming Jet with Real-Time Feedback Control

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Solution Overview

Problem

Current electroforming techniques for creating three-dimensional metal structures face limitations such as diffusion-layer-induced deposition rate constraints, instability in the deposition process, and difficulty in achieving large-scale, uniform structures, especially with metals like copper.

Innovation Solution

A method and system for localized electroforming using a jet of electrolytic solution to deposit material onto a conductive substrate, with real-time sensing and feedback to dynamically control deposition parameters, ensuring the achievement of a desired three-dimensional structure profile.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a jet of electrolytic solution is used for localized electroforming, then deposition rate and manufacturing speed are improved, but diffusion-layer formation near the cathode limits deposition uniformity and control

Engineering Contradiction:
Improvedeposition rateVSAvoiddeposition uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The system dynamically adjusts the voltage applied to the anode based on real-time feedback from deposition sensors. The voltage is modulated according to the measured deposition rate and uniformity, allowing the system to maintain optimal deposition conditions despite diffusion-layer formation. This dynamic control enables high deposition rates while preserving uniformity by compensating for local variations in real-time.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system incorporates real-time sensing of the deposition process with feedback control mechanisms. Sensors monitor the deposition rate and uniformity continuously, and this information is fed back to the power supply system to adjust the voltage and current parameters. This closed-loop feedback enables the system to overcome diffusion-layer limitations by actively compensating for their effects, maintaining both high productivity and manufacturing precision.

Inventive Principle:
Principle #23Feedback

2Reliability

If conventional electroforming techniques are used, then process stability is maintained, but the ability to create large-scale, complex three-dimensional structures is limited

Engineering Contradiction:
Improveprocess stabilityVSAvoidstructure scale
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The system divides the deposition process into multiple working spots that can be sequentially activated. By segmenting the overall structure into regions that can be deposited independently and in sequence, the system can build large-scale complex structures while maintaining process stability. Each working spot operates under controlled conditions, ensuring reliability even as the overall structure grows to large dimensions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system transitions from traditional two-dimensional deposition to three-dimensional structure building by utilizing vertical stacking of working spots and multi-layer deposition. This dimensional expansion allows the creation of large-scale complex structures with controlled stability, as each layer and spot can be independently optimized and monitored while contributing to the overall three-dimensional form.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Productivity

If high deposition rates are achieved through jet electroforming, then productivity increases, but deposition instability and profile control difficulty increase

Engineering Contradiction:
Improvedeposition rateVSAvoiddeposition stability
Core Design Contradiction:
ProductivityVSStability of the object's composition

Solution Approach 1:

The system employs dynamic voltage modulation at the anode based on real-time deposition monitoring. As the deposition rate increases, the system automatically adjusts voltage parameters to maintain stability, preventing runaway deposition or profile deviations. This dynamic adaptation allows the system to operate at high productivity levels while maintaining composition stability through continuous real-time control adjustments.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

Real-time feedback from deposition sensors directly controls the power supply parameters during high-rate deposition. The feedback loop detects any instability in the deposition process and immediately adjusts voltage and current to restore stability, enabling the system to sustain high productivity without sacrificing deposition stability or profile control.

Inventive Principle:
Principle #23Feedback

4Volume of moving object

If multiple working spots are used to build large structures, then structure size increases, but process complexity and control difficulty increase

Engineering Contradiction:
Improvestructure sizeVSAvoidprocess control complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The system uses a single multi-functional anode that can serve multiple working spots simultaneously or sequentially. This universal anode design reduces device complexity compared to having separate anodes for each spot, while still enabling the construction of large structures through coordinated multi-spot operation. The anode can be selectively activated at different positions and times, providing versatility without proportionally increasing system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The control system segments the deposition process into independently manageable working spots, each with its own controllable parameters. This segmentation allows complex large-scale structures to be built by coordinating simpler, independent deposition zones, reducing overall control complexity through modular organization rather than requiring monolithic control of the entire structure at once.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the creation of complex three-dimensional structures with improved deposition rate control and reduced instability, enabling the fabrication of large thicknesses of material with enhanced uniformity and precision.

Implementation Method 1

localized electroforming of at least one material from an electrolytic solution of said material, by means of a jet of said solution onto an electrically conductive deposition substrate

Methodology Applied
Scientific EffectElectrodeposition: Electrodeposition

Implementation Method 2

electroforming includes both aspects of electrodeposition and electroetching of a metal or any conductive material that can be reduced/oxidized from a liquid to a solid form

Methodology Applied
Scientific EffectElectrolysis: Electrolysis

Data Source

PatentUS12297554B2Real time, closed loop feedback jet-based localized electroforming method and system
Publication Date: 2025.05.13 ATHENA TECHNOLOGIES
  • US12297554B2 patent drawing
  • US12297554B2 patent drawing
  • US12297554B2 patent drawing

AI summary

A method for manufacturing a three-dimensional structure by localized electroforming of a material from an electrolytic solution includes emitting a jet of the electrolytic solution towards a target substrate, controlling position of the jet with respect to the target substrate, and controlling potential difference between a control electrode and the target substrate or an ion current intensity through the jet between the control electrode and the target substrate to obtain deposition of material on the target substrate or removal of material from the target substrate. The method further includes injecting a predetermined probing electrical current into an electroforming circuit including the control electrode, the jet, and the target substrate, detecting potential difference across the electroforming circuit, determining present elevation of the three-dimensional structure, comparing the present elevation with a predetermined design elevation and calculating a corresponding elevation difference, and modulating physical parameters of localized electroforming affecting deposition or removal rate.