Localized Purge Module for Substrate Handling Robots
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Solution Overview
Problem
Traditional gas purging methods for substrate handling systems, such as semiconductor wafer handling, are inefficient and lack precise environmental control, using high flows of purge gas and being expensive.
Innovation Solution
A substrate-handling robot with an end-effector and arm that translates between extended and retracted positions, featuring an enclosure with a shower to provide localized purging of purge gas directly to the substrate, reducing gas flow and cost by focusing on precise control near the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entire equipment front-end module is purged using high flow of purge gas, then oxygen removal and environmental control are achieved, but gas consumption and cost increase significantly
Solution Approach 1:
The patent divides the purging system into two distinct modes: a first shower that purges the entire equipment front-end module, and a second shower that provides localized purging only at the substrate position. This segmentation allows the system to switch between comprehensive purging and targeted purging, reducing overall purge gas consumption while maintaining environmental control when needed.
Solution Approach 2:
The second shower is positioned to deliver purge gas locally and directly to the substrate, rather than purging the entire module. This localized approach concentrates the purge gas flow where it is most needed (at the substrate position), achieving effective environmental control at the critical location while minimizing overall gas consumption.
2Reliability
If the entire equipment front-end module is purged, then oxygen is removed from the module, but precise environmental control near the substrate is not achieved
Solution Approach 1:
The second shower is specifically positioned to deliver purge gas locally and directly to the substrate, creating a concentrated inert atmosphere at the substrate position. This localized purging provides precise environmental control at the critical location where the substrate is handled, rather than distributing purge gas throughout the entire module.
Solution Approach 2:
The system segments the purging function into two distinct showers: the first shower handles bulk oxygen removal from the entire module, while the second shower provides targeted environmental control at the substrate position. This segmentation allows both comprehensive oxygen removal and precise local environmental control to be achieved simultaneously.
3Reliability
If full-module purging is performed, then environmental control is achieved, but system complexity and cost increase
Solution Approach 1:
The purging system is segmented into two distinct showers with different functions: a first shower for module-level purging and a second shower for substrate-level purging. This segmentation allows the system to achieve comprehensive environmental control through a modular approach, where each shower can be independently controlled and optimized, rather than requiring a single complex high-flow system.
Solution Approach 2:
Instead of continuously purging the entire module with high flow, the system uses the second shower to apply purge gas partially and locally only when needed at the substrate position. This partial action approach reduces overall gas consumption and system complexity while maintaining effective environmental control at the critical location.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables localized and precise gas purging with a lower flow of purge gas, reducing expenses and complexity compared to full-module purging, while ensuring a controlled environment for substrates.
Implementation Method 1
a flow of purge gas is provided through the shower to the substrate
Data Source
AI summary
A substrate-handling robot includes an end-effector to support a substrate and an arm, coupled to the end-effector, to translate the end-effector between an extended position and a retracted position. The substrate-handling robot also includes an enclosure to at least partially enclose the substrate with the substrate on the end-effector in the retracted position. The enclosure includes a shower to provide a flow of purge gas to the substrate.