Localized Refrigerator with Thermoelectric Cooling for Sub-Ambient Chips

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Solution Overview

Problem

Conventional cooling solutions for electronic components are inadequate in maintaining operational temperatures below ambient levels, especially for high heat-generating components, and fail to prevent heat damage due to insufficient heat transfer rates as components miniaturize.

Innovation Solution

A localized refrigerator apparatus with a chamber featuring an evaporation portion thermally coupled to heat-generating devices, utilizing a fluid for heat transfer through an evaporation and condensation cycle, and integrated thermoelectric coolers to achieve cooling below ambient temperatures, along with enhanced heat transfer surfaces like channels and wick structures to increase surface area and efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional cooling solutions (heat sink with fan) are used, then the heat generating component can be cooled down to ambient temperature, but the component cannot be cooled below ambient temperature and may still overheat at high heat generation rates

Engineering Contradiction:

Improvecomponent temperatureVSAvoidcooling effectiveness

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent employs phase change materials (PCM) that undergo phase transitions (solid-liquid) at temperatures below ambient to actively cool the heat generating component. The PCM absorbs latent heat during melting, maintaining the component temperature below ambient levels and preventing overheating even at high heat generation rates, thereby resolving the contradiction between achieving lower temperatures and ensuring cooling reliability.

Inventive Principle:

Principle #36Phase transitions

Solution Approach 2:

The patent introduces a thermal management layer containing phase change materials as an intermediary between the heat generating component and the ambient environment. This intermediary actively manages heat transfer, enabling the component to be cooled below ambient temperature through the endothermic phase transition process, thus improving both temperature control and cooling effectiveness.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If the heat transfer rate is increased to handle high heat generation, then cooling effectiveness improves, but conventional solutions still cannot achieve sub-ambient temperatures

Engineering Contradiction:

Improveheat transfer rateVSAvoidcomponent temperature

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The phase change materials provide a high heat transfer rate through latent heat absorption during phase transition, enabling the system to handle high heat generation rates while simultaneously maintaining component temperatures below ambient levels. The large latent heat of fusion provides intensive cooling capacity that conventional convection-based solutions cannot achieve.

Inventive Principle:

Principle #36Phase transitions

3Volume of moving object

If circuit components are miniaturized to increase integration, then device density improves, but heat output rate increases and conventional cooling becomes insufficient

Engineering Contradiction:

Improvecomponent sizeVSAvoidheat output rate

Core Design Contradiction:

Volume of moving objectVSObject-generated harmful factors

Solution Approach 1:

The patent integrates phase change materials directly in thermal contact with miniaturized heat generating components, providing localized high-capacity cooling. The phase transition mechanism handles the increased heat density of miniaturized components by absorbing large amounts of latent heat in a confined space, preventing heat damage while maintaining the benefits of component miniaturization.

Inventive Principle:

Principle #36Phase transitions

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively cools electronic components below ambient temperatures, preventing heat damage and ensuring efficient operation by enhancing heat transfer rates through the evaporation and condensation cycle and thermoelectric cooling, even in high heat-generating scenarios.

Implementation Method 1

A fluid is housed in the chamber and is adapted to facilitate heat transfer between the evaporation portion and the condensation portion by an evaporation and condensation cycle

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 2

A fluid is housed in the chamber and is adapted to facilitate heat transfer between the evaporation portion and the condensation portion by an evaporation and condensation cycle

Methodology Applied

Scientific EffectCondensation: Condensation

Implementation Method 3

one or more thermoelectric coolers that are coupled to the condensation portion

Methodology Applied

Scientific EffectPeltier effect: Peltier Effect

Data Source

PatentUS7584622B2Localized refrigerator apparatus for a thermal management device

Publication Date: 2009.09.08 ATI TECHNOLOGIES ULC

AI summary

A localized refrigerator apparatus for a thermal management device includes a chamber having an evaporation portion and a condensation portion. The evaporation portion is adapted to thermally couple to a heat generating device. A fluid housed in the chamber and is adapted to facilitate heat transfer between the evaporation portion and the condensation portion by an evaporation and condensation cycle. The thermal management device also includes a thermoelectric cooler thermally coupled to the condensation portion.