Localized TEC Cooling Array for Precise IC Thermal Control
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Solution Overview
Problem
Conventional thermal management approaches for integrated circuits fail to provide precise timing control over varying temperatures, leading to data link failures and increased errors, while existing solutions are inefficient and incur power/efficiency penalties.
Innovation Solution
An array of thermoelectric cooling cells with individual controllers and a single power connector, allowing for localized temperature control by dynamically adjusting the power to each cell based on sensed temperature, reducing unnecessary cooling and enhancing thermal management efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermoelectric cooler (TEC) is used to cool the entire chip, then temperature control is achieved, but power consumption increases and efficiency decreases
Solution Approach 1:
The chip surface is divided into multiple discrete cooling zones, each equipped with its own TEC device and controller. This segmentation allows only the specific regions requiring temperature control to be cooled, rather than cooling the entire chip, thereby reducing power consumption while maintaining effective temperature management in critical areas.
Solution Approach 2:
Different regions of the chip are provided with customized cooling based on their specific thermal requirements. Each cooling zone can be independently controlled to provide the exact temperature regulation needed for that particular area, optimizing power efficiency by avoiding unnecessary cooling of regions that do not require it.
2Measurement precision
If array of TEC devices with individual controllers is implemented, then localized temperature control precision is improved, but device complexity increases
Solution Approach 1:
Multiple TEC devices and their controllers are integrated into a unified array structure that shares common mounting infrastructure, electrical connections, and control architecture. This merging approach reduces the overall complexity that would otherwise result from having completely independent systems for each cooling zone, while still maintaining the precision benefits of individual control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise temperature regulation, reducing power consumption and simulation requirements, while maintaining accurate timing interfaces by targeting specific regions of the integrated circuit, thus improving thermal management efficiency and reducing errors.
Implementation Method 1
using an array of thermoelectric (TEC) devices to regulate temperature in specific locations of the circuit
Data Source
AI summary
A cooling device for integrated circuits. The device includes: a plurality TEC cooling cells arranged in an array, wherein each of the cells includes a controller coupled to at least one TEC device; and a single power connector that provides power to all the cells in the array. The controller of each cell in the array is operable to control the at least one TEC it is coupled to with power received from the single power connector.